Microsystems Engineers
Architecture and Engineering Occupations- O*NET-SOC code
- 17-2199.06
Research, design, develop, or test microelectromechanical systems (MEMS) devices.
- Data source: BLSPublished: 2026-08
Very high· relative
LowFour relative bandsVery highGroup-level value
Scale, basis and source
Four relative bands (Low / Moderate / High / Very high)
831 detailed occupations in the BLS Employment Projections table. Assigned per National Employment Matrix (NEM) code, so occupations sharing a NEM code carry the same band
- Data source: AnthropicPublished: 2026-03
0.066
0.000Range of values carried here0.745Group-level value
Scale, basis and source
Observed exposure index, 0–1 as published
Mapped onto O*NET tasks
Published per SOC 2018 occupation; every O*NET occupation with the same SOC 2018 code carries this value
- Data source: ILOPublished: 2025
0.30
0.09Range of values carried here0.70Group-level value
Scale, basis and source
Generative AI exposure index, 0–1 as published
Published per ISCO-08 unit group. Linked to this occupation, wholly or in part, by applying U.S. Bureau of Labor Statistics crosswalks (ISCO-08 to 2010 SOC, 2010 SOC to 2018 SOC) as published
What kind of figure this source publishes
The BLS category is a relative rank, not an absolute level, and it is not a first-hand measurement: it groups an occupation's percentile ranks across several published studies into four bands. It is not an employment or wage forecast, not a probability of adoption, and it does not separate automation from augmentation.
Task-level exposure
Exposed tasks only31 rated tasks · 23 tasks with β ≥ 0.5 (74.2%)
β = direct exposure (E1) + 0.5 × exposure when tools are available (E2), per the source repository's definition.
- Source unit: O*NET 27.2 tasks → O*NET 31.0 occupation code
- All rated tasks are in the O*NET 31.0 task list.
- Source
- OpenAI "GPTs are GPTs" exposure rubric
- Release
- gh-main-0471612
- License
- MIT License, Copyright (c) 2024 OpenAI
| Task (O*NET 20.1) | Claude.aiRaw / share % | APIRaw / share % |
|---|---|---|
Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software.17-2199.06 | 0.009325.1 | 0.002224.1 |
Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests.17-2199.06 | 0.008823.8 | 0.002932.2 |
Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology.17-2199.06 | 0.008222.2 | 0.001517.2 |
Develop customer documentation, such as performance specifications, training manuals, or operating instructions.17-2199.06 | 0.00318.4 | 0.002426.4 |
Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints.17-2199.06 | 0.00246.5 | —0 |
Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements.17-2199.06 | 0.00195.1 | —0 |
Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting.17-2199.06 | 0.00184.9 | —0 |
Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining.17-2199.06 | 0.00154.1 | —0 |
| Not observed on any surface — 23 task(s) — These tasks have no row in the source for this release. The 0 in the share row is a display-stage composition ratio; absence is what the — in the raw row states. | ||
Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications. | —0 | —0 |
Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology. | —0 | —0 |
Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays. | —0 | —0 |
Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications. | —0 | —0 |
Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems. | —0 | —0 |
Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes. | —0 | —0 |
Demonstrate miniaturized systems that contain components such as microsensors, microactuators, or integrated electronic circuits fabricated on silicon or silicon carbide wafers. | —0 | —0 |
Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements. | —0 | —0 |
Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications. | —0 | —0 |
Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints. | —0 | —0 |
Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing. | —0 | —0 |
Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability. | —0 | —0 |
Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining. | —0 | —0 |
Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement. | —0 | —0 |
Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes. | —0 | —0 |
Conduct analyses addressing issues such as failure, reliability, or yield improvement. | —0 | —0 |
Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing. | —0 | —0 |
Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software. | —0 | —0 |
Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology. | —0 | —0 |
Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices. | —0 | —0 |
Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines. | —0 | —0 |
Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications. | —0 | —0 |
Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy. | —0 | —0 |
Values in this tab are predicted labels, not observations. Eloundou et al. (2023) published two rating regimes — human raters and GPT-4 — and the β shown here is derived from the GPT-4 rater basis alone; the same task can take a different value under the other regime. The unit and the meaning differ from the observed shares (%) in the other tabs, so do not place them on the same axis.
| Task (O*NET 27.2) | βE1 + 0.5 × E2 |
|---|---|
Develop customer documentation, such as performance specifications, training manuals, or operating instructions.O*NET Task ID 16488 | 1.0 |
Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes.O*NET Task ID 16490 | 1.0 |
Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements.O*NET Task ID 16492 | 1.0 |
Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices.O*NET Task ID 19658 | 1.0 |
Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines.O*NET Task ID 19659 | 1.0 |
Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications.O*NET Task ID 19660 | 1.0 |
Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy.O*NET Task ID 19661 | 1.0 |
Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications.O*NET Task ID 16484 | 0.5 |
Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology.O*NET Task ID 16485 | 0.5 |
Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems.O*NET Task ID 16489 | 0.5 |
Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications.O*NET Task ID 16493 | 0.5 |
Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints.O*NET Task ID 16494 | 0.5 |
Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements.O*NET Task ID 16495 | 0.5 |
Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software.O*NET Task ID 16497 | 0.5 |
Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability.O*NET Task ID 16498 | 0.5 |
Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement.O*NET Task ID 16501 | 0.5 |
Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting.O*NET Task ID 16502 | 0.5 |
Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints.O*NET Task ID 16503 | 0.5 |
Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes.O*NET Task ID 16504 | 0.5 |
Conduct analyses addressing issues such as failure, reliability, or yield improvement.O*NET Task ID 16505 | 0.5 |
Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology.O*NET Task ID 16506 | 0.5 |
Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing.O*NET Task ID 16507 | 0.5 |
Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology.O*NET Task ID 19656 | 0.5 |
Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays.O*NET Task ID 16486 | 0.0 |
Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications.O*NET Task ID 16487 | 0.0 |
Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers.O*NET Task ID 16491 | 0.0 |
Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing.O*NET Task ID 16496 | 0.0 |
Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining.O*NET Task ID 16499 | 0.0 |
Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests.O*NET Task ID 16500 | 0.0 |
Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software.O*NET Task ID 16508 | 0.0 |
Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining.O*NET Task ID 19657 | 0.0 |
β = E1 + 0.5 × E2 · E1 = tasks where direct LLM access alone cuts time by at least 50%, E2 = tasks where software built on top of an LLM cuts time by at least 50%. Values take only 0 / 0.5 / 1.0.
Data sources & licenses — O*NET®, Anthropic Economic Index, Eloundou et al. (2023): see full notices on the Credits page
All O*NET 31.0 task statements (31)
All O*NET 31.0 task statements for this occupation (English, as published; task type core or supplemental). Exposure values are not listed here; they are in the table above, next to each task statement as worded in the O*NET version each source used.
| Task (O*NET 31.0) | Type |
|---|---|
| Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology. | Core |
| Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes. | Core |
| Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements. | Core |
| Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements. | Core |
| Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software. | Core |
| Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting. | Core |
| Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints. | Core |
| Conduct analyses addressing issues such as failure, reliability, or yield improvement. | Core |
| Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications. | Supplemental |
| Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays. | Supplemental |
| Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications. | Supplemental |
| Develop customer documentation, such as performance specifications, training manuals, or operating instructions. | Supplemental |
| Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems. | Supplemental |
| Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers. | Supplemental |
| Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications. | Supplemental |
| Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints. | Supplemental |
| Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing. | Supplemental |
| Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability. | Supplemental |
| Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining. | Supplemental |
| Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests. | Supplemental |
| Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement. | Supplemental |
| Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes. | Supplemental |
| Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology. | Supplemental |
| Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing. | Supplemental |
| Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software. | Supplemental |
| Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology. | — |
| Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining. | — |
| Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices. | — |
| Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines. | — |
| Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications. | — |
| Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy. | — |
0.15/ 3· Robot exposure index
Scale, basis and source
Each physical task is graded 0–3 by the setting in which robots that have been deployed, sold or demonstrated could do it (0 none · 1 purpose-built robot settings such as a fenced machine cell or a bottling line · 2 structured facilities such as a hospital pharmacy or a container port · 3 unstructured settings such as a private home or a construction site), and the grades are averaged by share of working time
Physical tasks among this occupation's O*NET 29.3 tasks
Anthropic estimated the grades and time shares with Claude Opus 5 using web search, as of 2026.
The robot exposure index is a different measure from the AI exposure figures on this site and cannot be added to or compared with them. It does not measure actual adoption or cost, and 0 also covers occupations with no physical tasks.
Tier of each physical task
Robot environment tiers (E0–E3)
E0 noneDetails
Rated not doable by robots that have been deployed, sold or demonstrated, even in a purpose-built setting
E1 purpose-built robot settingsDetails
Rated doable in a setting built around the machine, such as a fenced machine cell or a bottling line
E2 structured facilitiesDetails
Rated doable in a human work facility that an institution keeps to a working standard, such as a hospital pharmacy or a container port
E3 unstructured settingsDetails
Rated doable in a setting that no institution keeps to a working standard, such as a private home or a construction site
Only tasks classified as physical are listed; other tasks have no tier in the source.
| Task (O*NET 29.3) | Robot environment tier |
|---|---|
| Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers. | E0 none |
| Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes. | E1 purpose-built robot settings |
| Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology. | E1 purpose-built robot settings |
| Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software. | E1 purpose-built robot settings |
| Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining. | E0 none |
| Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy. | E1 purpose-built robot settings |
Occupation information
Employment outlook (BLS)
Values for the whole SOC 17-2199 group (Engineers, all other), not for this O*NET occupation alone.
- Employment, 2025
- 167K
- Projected employment, 2035
- 173K
- Change (2025–35)
- +3.7%
- Median annual wage, 2025
- $122,930
- Typical education needed for entry
- Bachelor's degree
Korea classification links (KSCO)
Links from the current release of the Korea Occupation Direct Crosswalk v1.1, made by AI Changing Work. Relation values are read from the O*NET-SOC occupation side.
| KSCO code | KSCO title | Relation | Status |
|---|---|---|---|
| 23439 | 그 외 전자공학 기술자 및 연구원 | Related, not a match | confirmed |
Relation and status definitions(kr-direct v1.1)
ILO occupational description
AI Changing Work links the ISCO-08 unit groups below to this occupation by applying the U.S. Bureau of Labor Statistics crosswalks (2018 SOC to 2010 SOC, 2010 SOC to ISCO-08) as published, without case-by-case selection; each link may be whole or partial.
- ISCO-08 2149Engineering Professionals Not Elsewhere Classified
The definition, tasks and examples below are the ILO's description of that unit group, not of this occupation.
This unit group covers engineering professionals not classified elsewhere in Minor Group 214: Engineering Professionals (excluding Electrotechnology) or in Minor Group 215: Electrotechnology Engineers. For instance, the group includes those who conduct research and advise on or develop engineering procedures and solutions concerning workplace safety, biomedical engineering, optics, materials, nuclear power generation and explosives.
Tasks
- In such cases tasks would include -
- (a) applying knowledge of engineering to the design, development and evaluation of biological and health systems and products such as artificial organs, prostheses and instrumentation;
- (b) designing devices used in various medical procedures and imaging systems such as magnetic resonance imaging, and devices for automating insulin injections or controlling body functions;
- (c) designing components of optical instruments such as lenses, microscopes, telescopes, lasers, optical disc systems and other equipment that utilize the properties of light;
- (d) designing, testing, and coordinating the development of explosive ordnance material to meet military procurement specifications;
- (e) designing and overseeing construction and operation of nuclear reactors and power plants and nuclear fuels reprocessing and reclamation systems;
- (f) designing and developing nuclear equipment such as reactor cores, radiation shielding and associated instrumentation and control mechanisms;
- (g) assessing damage and providing calculations for marine salvage operations;
- (h) studying and advising on engineering aspects of particular manufacturing processes, such as those related to glass, ceramics, textiles, leather products, wood and printing;
- (i) identifying potential hazards and introducing safety procedures and devices.
Example occupations
Biomedical engineer · Explosive ordnance engineer · Marine salvage engineer · Materials engineer · Nuclear power generation engineer · Optical engineer · Quantity surveyor · Safety engineer
Sources: ILO ISCO-08 — details: Credits
ESCO occupational vocabulary
Each entry below is matched to this occupation in the published ESCO-O*NET Crosswalk (version 1, 2022). The match types are that crosswalk's; the wording is AI Changing Work's.
- microsystem engineerESCO 2152.1.7Same scope
Microsystem engineers research, design, develop, and supervise the production of microelectromechanical systems (MEMS), which can be integrated in mechanical, optical, acoustic, and electronic products.
Source: European Commission, DG EMPL — ESCO API 2026-08-08 (bridge v1.2.1)
License: CC BY 4.0 (EU Reuse Notice)
ESCO reuse terms and the modification notice are in Credits.
France classification links (ROME)
AI Changing Work's links between this occupation and ROME 4.0 job profiles, judged with AI models. Relations are read from this occupation's side. Links marked “provisional” were adopted on the judgments of two judges from the same model family (Claude) alone, or by an operator rule applied to their judgments, so they rest on weaker evidence than confirmed links.
| ROME code | ROME title (French) | Relation |
|---|---|---|
| H1206 | Ingénieur / Ingénieure R&D en industrie | This occupation is narrowerprovisional |
| K2402 | Ingénieur / Ingénieure de recherche scientifique | Related, not a matchprovisional |
Source: France Travail — Répertoire Opérationnel des Métiers et des Emplois (ROME 4.0), version 61, last updated 15 June 2026 (https://www.data.gouv.fr/datasets/repertoire-operationnel-des-metiers-et-des-emplois-rome). Licence Ouverte 2.0.
ROME codes and titles are reproduced unchanged; the links to O*NET-SOC occupations are AI Changing Work's own judgment and are not a France Travail correspondence.
(AI Changing Work link release: fr-direct v1)
Spain classification links (CNO-11)
AI Changing Work's links between this occupation and CNO-11 occupations, judged with AI models. Relations are read from this occupation's side.
| CNO-11 code | CNO-11 title (Spanish) | Relation |
|---|---|---|
| 2442 | Ingenieros electrónicos | This occupation is narrower |
| 2439 | Ingenieros no clasificados bajo otros epígrafes | Related, not a match |
| 2472 | Ingenieros técnicos en electrónica | Related, not a match |
Source: Instituto Nacional de Estadística (INE), National Classification of Occupations 2011 (CNO-11, Royal Decree 1591/2010) — www.ine.es · Licensed CC BY 4.0. CNO-11 codes and Spanish titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own judgment and are not an INE correspondence.
(AI Changing Work link release: es-direct v1)
Germany classification links (KldB)
AI Changing Work's links between this occupation and KldB occupations, judged with AI models. Relations are read from this occupation's side.
| KldB code | KldB title (German) | Relation |
|---|---|---|
| 26324 | Berufe in der Mikrosystemtechnik - hoch komplexe Tätigkeiten | This occupation is narrowerprovisional |
Source: © Statistik der Bundesagentur für Arbeit — Klassifikation der Berufe 2010 – überarbeitete Fassung 2020, https://statistik.arbeitsagentur.de. KldB codes and titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own mapping (eigene Zuordnung) and are not a Bundesagentur für Arbeit correspondence.
(AI Changing Work link release: de-direct v1)
Japan classification links (JSCO)
AI Changing Work's links between this occupation and JSCO occupations, judged with AI models. Relations are read from this occupation's side.
| JSCO code | JSCO title (Japanese) | Relation |
|---|---|---|
| 072 | 電気・電子・電気通信技術者（通信ネットワーク技術者を除く）（開発） | This occupation is narrower |
| 082 | 電気・電子・電気通信技術者（通信ネットワーク技術者を除く）（開発を除く） | Related, not a match |
Source: Ministry of Internal Affairs and Communications (MIC), Japan Standard Occupational Classification (Dec. 2009, MIC Notification No. 555). JSCO codes and Japanese titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own judgment and are not a MIC correspondence.
(AI Changing Work link release: jp-direct v1)
Sources, licenses and AI Changing Work's modification and translation notices for this page: Credits & sources