Microsystems Engineers
Architecture and Engineering Occupations- رمز O*NET-SOC
- 17-2199.06
Research, design, develop, or test microelectromechanical systems (MEMS) devices.
- مصدر البيانات: BLSتاريخ النشر: 2026-08
مرتفع جدًا· نسبي
منخفضأربع فئات نسبيةمرتفع جدًاقيمة على مستوى المجموعة المهنية
المقياس والأساس والمصدر
أربع فئات نسبية (منخفض / متوسط / مرتفع / مرتفع جدًا)
831 مهنة تفصيلية في جدول توقعات التوظيف لدى BLS. وتُسند القيمة على مستوى رمز مصفوفة التوظيف الوطنية (NEM)، فالمهن التي تشترك في الرمز نفسه تأخذ النطاق نفسه
- مصدر البيانات: Anthropicتاريخ النشر: 2026-03
0.066
0.000نطاق القيم المعروضة هنا0.745قيمة على مستوى المجموعة المهنية
المقياس والأساس والمصدر
مؤشر التعرّض المرصود، 0–1 كما نُشر
مربوط بمهام O*NET
منشورة لكل مهنة في SOC 2018؛ وكل مهنة في O*NET تحمل رمز SOC 2018 نفسه تأخذ هذه القيمة
- مصدر البيانات: ILOتاريخ النشر: 2025
0.30
0.09نطاق القيم المعروضة هنا0.70قيمة على مستوى المجموعة المهنية
المقياس والأساس والمصدر
مؤشر التعرّض للذكاء الاصطناعي التوليدي، 0–1 كما نُشر
قيمة منشورة على مستوى مجموعة الوحدة في ISCO-08. رُبطت بهذه المهنة بتطبيق جداول التناظر الرسمية لمكتب إحصاءات العمل الأمريكي (BLS) (من ISCO-08 إلى SOC 2010، ومن SOC 2010 إلى SOC 2018) كما نُشرت، والتناظر كلي أو جزئي
ما نوع القيمة التي ينشرها هذا المصدر
فئة BLS رتبة نسبية لا مستوى مطلق، وليست قياسًا مباشرًا: فهي تجمع الرتب المئينية للمهنة في عدة دراسات منشورة في أربع فئات. وهي ليست توقّعًا للتوظيف أو الأجور، ولا احتمالًا للتبني، ولا تفرّق بين الأتمتة والتعزيز.
Task-level exposure
المهام ذات التعرّض فقط31 مهمة مقيَّمة · 23 مهمة بقيمة β ≥ 0.5 (74.2%)
β = التعرّض المباشر (E1) + 0.5 × التعرّض عند توفر الأدوات (E2)، وفق تعريف المستودع المصدري.
- وحدة المصدر: مهام O*NET 27.2 ← رمز المهنة في O*NET 31.0
- جميع المهام المقيَّمة موجودة في قائمة مهام O*NET 31.0.
- المصدر
- OpenAI "GPTs are GPTs" exposure rubric
- الإصدار
- gh-main-0471612
- الترخيص
- MIT License, Copyright (c) 2024 OpenAI
| Task (O*NET 20.1) | Claude.aiRaw / share % | APIRaw / share % |
|---|---|---|
Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software.17-2199.06 | 0.008622.6 | 0.005432.9 |
Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology.17-2199.06 | 0.008021.0 | 0.002615.9 |
Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests.17-2199.06 | 0.006015.7 | 0.003118.9 |
Develop customer documentation, such as performance specifications, training manuals, or operating instructions.17-2199.06 | 0.005815.2 | 0.001911.6 |
Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints.17-2199.06 | 0.00369.4 | 0.001710.4 |
Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting.17-2199.06 | 0.00236.0 | 0.001710.4 |
Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements.17-2199.06 | 0.00236.0 | —0 |
Demonstrate miniaturized systems that contain components such as microsensors, microactuators, or integrated electronic circuits fabricated on silicon or silicon carbide wafers.17-2199.06 | 0.00153.9 | —0 |
| Not observed on any surface — 23 task(s) — These tasks have no row in the source for this release. The 0 in the share row is a display-stage composition ratio; absence is what the — in the raw row states. | ||
Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications. | —0 | —0 |
Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology. | —0 | —0 |
Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays. | —0 | —0 |
Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications. | —0 | —0 |
Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems. | —0 | —0 |
Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes. | —0 | —0 |
Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements. | —0 | —0 |
Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications. | —0 | —0 |
Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints. | —0 | —0 |
Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing. | —0 | —0 |
Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability. | —0 | —0 |
Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining. | —0 | —0 |
Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement. | —0 | —0 |
Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes. | —0 | —0 |
Conduct analyses addressing issues such as failure, reliability, or yield improvement. | —0 | —0 |
Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing. | —0 | —0 |
Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software. | —0 | —0 |
Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology. | —0 | —0 |
Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining. | —0 | —0 |
Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices. | —0 | —0 |
Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines. | —0 | —0 |
Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications. | —0 | —0 |
Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy. | —0 | —0 |
Values in this tab are predicted labels, not observations. Eloundou et al. (2023) published two rating regimes — human raters and GPT-4 — and the β shown here is derived from the GPT-4 rater basis alone; the same task can take a different value under the other regime. The unit and the meaning differ from the observed shares (%) in the other tabs, so do not place them on the same axis.
| Task (O*NET 27.2) | βE1 + 0.5 × E2 |
|---|---|
Develop customer documentation, such as performance specifications, training manuals, or operating instructions.O*NET Task ID 16488 | 1.0 |
Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes.O*NET Task ID 16490 | 1.0 |
Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements.O*NET Task ID 16492 | 1.0 |
Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices.O*NET Task ID 19658 | 1.0 |
Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines.O*NET Task ID 19659 | 1.0 |
Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications.O*NET Task ID 19660 | 1.0 |
Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy.O*NET Task ID 19661 | 1.0 |
Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications.O*NET Task ID 16484 | 0.5 |
Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology.O*NET Task ID 16485 | 0.5 |
Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems.O*NET Task ID 16489 | 0.5 |
Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications.O*NET Task ID 16493 | 0.5 |
Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints.O*NET Task ID 16494 | 0.5 |
Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements.O*NET Task ID 16495 | 0.5 |
Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software.O*NET Task ID 16497 | 0.5 |
Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability.O*NET Task ID 16498 | 0.5 |
Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement.O*NET Task ID 16501 | 0.5 |
Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting.O*NET Task ID 16502 | 0.5 |
Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints.O*NET Task ID 16503 | 0.5 |
Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes.O*NET Task ID 16504 | 0.5 |
Conduct analyses addressing issues such as failure, reliability, or yield improvement.O*NET Task ID 16505 | 0.5 |
Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology.O*NET Task ID 16506 | 0.5 |
Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing.O*NET Task ID 16507 | 0.5 |
Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology.O*NET Task ID 19656 | 0.5 |
Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays.O*NET Task ID 16486 | 0.0 |
Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications.O*NET Task ID 16487 | 0.0 |
Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers.O*NET Task ID 16491 | 0.0 |
Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing.O*NET Task ID 16496 | 0.0 |
Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining.O*NET Task ID 16499 | 0.0 |
Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests.O*NET Task ID 16500 | 0.0 |
Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software.O*NET Task ID 16508 | 0.0 |
Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining.O*NET Task ID 19657 | 0.0 |
β = E1 + 0.5 × E2 · E1 = tasks where direct LLM access alone cuts time by at least 50%, E2 = tasks where software built on top of an LLM cuts time by at least 50%. Values take only 0 / 0.5 / 1.0.
Data sources & licenses — O*NET®, Anthropic Economic Index, Eloundou et al. (2023): see full notices on the Credits page
جميع مهام O*NET 31.0 (31)
جميع مهام O*NET 31.0 لهذه المهنة (بالإنجليزية كما نُشرت؛ نوع المهمة أساسية أو تكميلية). لا تُدرج قيم التعرّض في هذه القائمة؛ فهي في الجدول أعلاه، بجوار كل مهمة بالصيغة الواردة في إصدار O*NET الذي استخدمه كل مصدر.
| المهمة (O*NET 31.0) | النوع |
|---|---|
| Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology. | أساسية |
| Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes. | أساسية |
| Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements. | أساسية |
| Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements. | أساسية |
| Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software. | أساسية |
| Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting. | أساسية |
| Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints. | أساسية |
| Conduct analyses addressing issues such as failure, reliability, or yield improvement. | أساسية |
| Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications. | تكميلية |
| Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays. | تكميلية |
| Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications. | تكميلية |
| Develop customer documentation, such as performance specifications, training manuals, or operating instructions. | تكميلية |
| Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems. | تكميلية |
| Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers. | تكميلية |
| Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications. | تكميلية |
| Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints. | تكميلية |
| Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing. | تكميلية |
| Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability. | تكميلية |
| Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining. | تكميلية |
| Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests. | تكميلية |
| Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement. | تكميلية |
| Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes. | تكميلية |
| Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology. | تكميلية |
| Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing. | تكميلية |
| Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software. | تكميلية |
| Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology. | — |
| Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining. | — |
| Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices. | — |
| Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines. | — |
| Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications. | — |
| Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy. | — |
0.15/ 3· مؤشر التعرّض للروبوتات
المقياس والأساس والمصدر
تُمنح كل مهمة بدنية درجة من 0 إلى 3 بحسب البيئة التي يمكن فيها لروبوتات سبق نشرها أو بيعها أو عرضها أن تؤديها (0 لا شيء · 1 بيئات مخصصة للروبوتات مثل خلية آلات مسيّجة أو خط تعبئة زجاجات · 2 منشآت منظَّمة مثل صيدلية مستشفى أو ميناء حاويات · 3 بيئات غير منظَّمة مثل منزل خاص أو موقع بناء)، ثم يُحسب متوسط الدرجات بحسب حصة كل مهمة من وقت العمل
المهام البدنية من بين مهام O*NET 29.3 لهذه المهنة
قدّرت Anthropic الدرجات وحصص الوقت باستخدام Claude Opus 5 مع البحث على الويب (الوضع في 2026).
مؤشر التعرّض للروبوتات مقياس مختلف عن أرقام التعرّض للذكاء الاصطناعي في هذا الموقع، فلا يمكن جمعه معها ولا مقارنته بها. ولا يقيس التبني الفعلي ولا التكلفة، ويشمل الصفر أيضًا المهن التي لا تتضمن مهام بدنية.
درجة كل مهمة بدنية
مستويات بيئة الروبوت (E0–E3)
E0 لا شيءالتفاصيل
قُيّمت بأنها غير قابلة للتنفيذ بواسطة روبوتات سبق نشرها أو بيعها أو عرضها، حتى في بيئة مخصصة للروبوتات
E1 بيئات مخصصة للروبوتاتالتفاصيل
قُيّمت بأنها قابلة للتنفيذ في بيئة مبنية حول الآلة، مثل خلية آلات مسيّجة أو خط تعبئة زجاجات
E2 منشآت منظَّمةالتفاصيل
قُيّمت بأنها قابلة للتنفيذ في منشأة عمل بشرية تحافظ عليها مؤسسة وفق معيار عمل، مثل صيدلية مستشفى أو ميناء حاويات
E3 بيئات غير منظَّمةالتفاصيل
قُيّمت بأنها قابلة للتنفيذ في بيئة لا تحافظ عليها أي مؤسسة وفق معيار عمل، مثل منزل خاص أو موقع بناء
لا تُدرج إلا المهام المصنّفة على أنها بدنية؛ أما المهام الأخرى فليس لها مستوى في المصدر.
| المهمة (O*NET 29.3) | مستوى بيئة الروبوت |
|---|---|
| Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers. | E0 لا شيء |
| Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes. | E1 بيئات مخصصة للروبوتات |
| Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology. | E1 بيئات مخصصة للروبوتات |
| Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software. | E1 بيئات مخصصة للروبوتات |
| Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining. | E0 لا شيء |
| Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy. | E1 بيئات مخصصة للروبوتات |
معلومات مهنية
آفاق التوظيف (BLS)
القيم لمجموعة SOC 17-2199 بأكملها (Engineers, all other)، وليست لهذه المهنة في O*NET وحدها.
- التوظيف، 2025
- 167K
- التوظيف المتوقع، 2035
- 173K
- التغيّر (2025–35)
- +3.7%
- الأجر السنوي الوسيط، 2025
- $122,930
- المؤهل التعليمي المعتاد للالتحاق
- Bachelor's degree
الروابط بالتصنيف الكوري (KSCO)
روابط من الإصدار الحالي لـ Korea Occupation Direct Crosswalk v1.1، من إعداد AI Changing Work. تُقرأ قيم العلاقة من جهة مهنة O*NET-SOC.
| رمز KSCO | اسم KSCO | العلاقة | الحالة |
|---|---|---|---|
| 23439 | 그 외 전자공학 기술자 및 연구원 | ذات صلة، وليست مطابقة | مؤكَّد |
تعريفات العلاقة والحالة(kr-direct v1.1)
الوصف المهني لمنظمة العمل الدولية (ILO)
تربط AI Changing Work مجموعات الوحدات في ISCO-08 أدناه بهذه المهنة بتطبيق جداول التناظر الصادرة عن مكتب إحصاءات العمل الأمريكي (BLS) (SOC 2018 إلى SOC 2010، وSOC 2010 إلى ISCO-08) كما نُشرت، دون انتقاء حالة بحالة؛ وقد يكون كل ربط كليًا أو جزئيًا.
- ISCO-08 2149Engineering Professionals Not Elsewhere Classified
المهندسون غير المصنفين في موضع آخر
ILOSTAT — ISCO-08 Structure EN AR v1.0 (2021), translated by the Regional Working Group on Labour Indicators in the Arab Region / ILO Dept. of Statistics + ROAS
التعريف والمهام والأمثلة أدناه هي وصف منظمة العمل الدولية لمجموعة الوحدات تلك، لا لهذه المهنة.
This unit group covers engineering professionals not classified elsewhere in Minor Group 214: Engineering Professionals (excluding Electrotechnology) or in Minor Group 215: Electrotechnology Engineers. For instance, the group includes those who conduct research and advise on or develop engineering procedures and solutions concerning workplace safety, biomedical engineering, optics, materials, nuclear power generation and explosives.
المهام
- In such cases tasks would include -
- (a) applying knowledge of engineering to the design, development and evaluation of biological and health systems and products such as artificial organs, prostheses and instrumentation;
- (b) designing devices used in various medical procedures and imaging systems such as magnetic resonance imaging, and devices for automating insulin injections or controlling body functions;
- (c) designing components of optical instruments such as lenses, microscopes, telescopes, lasers, optical disc systems and other equipment that utilize the properties of light;
- (d) designing, testing, and coordinating the development of explosive ordnance material to meet military procurement specifications;
- (e) designing and overseeing construction and operation of nuclear reactors and power plants and nuclear fuels reprocessing and reclamation systems;
- (f) designing and developing nuclear equipment such as reactor cores, radiation shielding and associated instrumentation and control mechanisms;
- (g) assessing damage and providing calculations for marine salvage operations;
- (h) studying and advising on engineering aspects of particular manufacturing processes, such as those related to glass, ceramics, textiles, leather products, wood and printing;
- (i) identifying potential hazards and introducing safety procedures and devices.
أمثلة على المهن
Biomedical engineer · Explosive ordnance engineer · Marine salvage engineer · Materials engineer · Nuclear power generation engineer · Optical engineer · Quantity surveyor · Safety engineer
Sources: ILO ISCO-08 — details: Credits
مفردات ESCO المهنية
كل عنصر أدناه مُطابَق مع هذه المهنة في ESCO-O*NET Crosswalk المنشور (الإصدار 1، 2022). أنواع المطابقة هي أنواع ذلك الجدول، أما الصياغة فمن AI Changing Work.
- مهندس نظم دقيقة / مهندسة نظم دقيقةESCO 2152.1.7النطاق نفسه
يتولى مهندسو النظم الدقيقة إجراء أبحاث عن إنتاج الأنظمة الكهروميكانيكية الدقيقة (MEMS) وتصميمها وتطويرها والإشراف عليها، والتي يمكن دمجها في المنتجات الميكانيكية والبصرية والصوتية والإلكترونية.
المصدر: European Commission, DG EMPL — ESCO API 2026-08-08 (bridge v1.2.1)
الترخيص: CC BY 4.0 (EU Reuse Notice)
ESCO reuse terms and the modification notice are in Credits.
الروابط بالتصنيف الفرنسي (ROME)
روابط بين هذه المهنة وبطاقات ROME 4.0 حددتها AI Changing Work باستخدام نماذج ذكاء اصطناعي. تُقرأ العلاقات من جهة هذه المهنة. الروابط الموسومة بـ«مؤقت» اعتُمدت بالاستناد فقط إلى تقييمات مُقيِّمَين من عائلة النماذج نفسها (Claude)، أو بتطبيق قاعدة وضعها المُشغِّل على تلك التقييمات، ولذلك فهي تقوم على أدلة أضعف من الروابط المؤكَّدة.
| رمز ROME | تسمية ROME (بالفرنسية) | العلاقة |
|---|---|---|
| H1206 | Ingénieur / Ingénieure R&D en industrie | هذه المهنة أضيقمؤقت |
| K2402 | Ingénieur / Ingénieure de recherche scientifique | ذات صلة، وليست مطابقةمؤقت |
Source: France Travail — Répertoire Opérationnel des Métiers et des Emplois (ROME 4.0), version 61, last updated 15 June 2026 (https://www.data.gouv.fr/datasets/repertoire-operationnel-des-metiers-et-des-emplois-rome). Licence Ouverte 2.0.
ROME codes and titles are reproduced unchanged; the links to O*NET-SOC occupations are AI Changing Work's own judgment and are not a France Travail correspondence.
(AI Changing Work link release: fr-direct v1)
الروابط بالتصنيف الإسباني (CNO-11)
روابط بين هذه المهنة ومهن CNO-11 حددتها AI Changing Work باستخدام نماذج ذكاء اصطناعي. تُقرأ العلاقات من جهة هذه المهنة.
| رمز CNO-11 | تسمية CNO-11 (بالإسبانية) | العلاقة |
|---|---|---|
| 2442 | Ingenieros electrónicos | هذه المهنة أضيق |
| 2439 | Ingenieros no clasificados bajo otros epígrafes | ذات صلة، وليست مطابقة |
| 2472 | Ingenieros técnicos en electrónica | ذات صلة، وليست مطابقة |
Source: Instituto Nacional de Estadística (INE), National Classification of Occupations 2011 (CNO-11, Royal Decree 1591/2010) — www.ine.es · Licensed CC BY 4.0. CNO-11 codes and Spanish titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own judgment and are not an INE correspondence.
(AI Changing Work link release: es-direct v1)
الروابط بالتصنيف الألماني (KldB)
روابط بين هذه المهنة ومهن KldB حددتها AI Changing Work باستخدام نماذج ذكاء اصطناعي. تُقرأ العلاقات من جهة هذه المهنة.
| رمز KldB | تسمية KldB (بالألمانية) | العلاقة |
|---|---|---|
| 26324 | Berufe in der Mikrosystemtechnik - hoch komplexe Tätigkeiten | هذه المهنة أضيقمؤقت |
Source: © Statistik der Bundesagentur für Arbeit — Klassifikation der Berufe 2010 – überarbeitete Fassung 2020, https://statistik.arbeitsagentur.de. KldB codes and titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own mapping (eigene Zuordnung) and are not a Bundesagentur für Arbeit correspondence.
(AI Changing Work link release: de-direct v1)
الروابط بالتصنيف الياباني (JSCO)
روابط بين هذه المهنة ومهن JSCO حددتها AI Changing Work باستخدام نماذج ذكاء اصطناعي. تُقرأ العلاقات من جهة هذه المهنة.
| رمز JSCO | تسمية JSCO (باليابانية) | العلاقة |
|---|---|---|
| 072 | 電気・電子・電気通信技術者（通信ネットワーク技術者を除く）（開発） | هذه المهنة أضيق |
| 082 | 電気・電子・電気通信技術者（通信ネットワーク技術者を除く）（開発を除く） | ذات صلة، وليست مطابقة |
Source: Ministry of Internal Affairs and Communications (MIC), Japan Standard Occupational Classification (Dec. 2009, MIC Notification No. 555). JSCO codes and Japanese titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own judgment and are not a MIC correspondence.
(AI Changing Work link release: jp-direct v1)
مصادر بيانات هذه الصفحة وتراخيصها وإشعارات التعديل والترجمة الصادرة عن AI Changing Work: الاعتمادات والمصادر