Semiconductor Processing Technicians
Production Occupations- O*NET-SOC code
- 51-9141.00
Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.
- Data source: BLSPublished: 2026-08
Moderate· relative
LowFour relative bandsVery highGroup-level value
Scale, basis and source
Four relative bands (Low / Moderate / High / Very high)
831 detailed occupations in the BLS Employment Projections table. Assigned per National Employment Matrix (NEM) code, so occupations sharing a NEM code carry the same band
- Data source: AnthropicPublished: 2026-03
0.000
0.000Range of values carried here0.745Scale, basis and source
Observed exposure index, 0–1 as published
Mapped onto O*NET tasks
Published per SOC 2018 occupation; every O*NET occupation with the same SOC 2018 code carries this value
- Data source: OpenAIPublished: 2023
0.063
0.000Range of values carried here0.844Scale, basis and source
What kind of figure this source publishes
The BLS category is a relative rank, not an absolute level, and it is not a first-hand measurement: it groups an occupation's percentile ranks across several published studies into four bands. It is not an employment or wage forecast, not a probability of adoption, and it does not separate automation from augmentation.
Task-level exposure
Exposed tasks only24 rated tasks · 6 tasks with β ≥ 0.5 (25.0%)
β = direct exposure (E1) + 0.5 × exposure when tools are available (E2), per the source repository's definition.
- Source unit: O*NET 27.2 tasks → O*NET 31.0 occupation code
- 7 rated tasks are not in the O*NET 31.0 task list; their scores are kept as published for O*NET 27.2.
- Source
- OpenAI "GPTs are GPTs" exposure rubric
- Release
- gh-main-0471612
- License
- MIT License, Copyright (c) 2024 OpenAI
Values in this tab are predicted labels, not observations. Eloundou et al. (2023) published two rating regimes — human raters and GPT-4 — and the β shown here is derived from the GPT-4 rater basis alone; the same task can take a different value under the other regime.
| Task (O*NET 27.2) | βE1 + 0.5 × E2 |
|---|---|
Maintain processing, production, and inspection information and reports.O*NET Task ID 12574 | 1.0 |
Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.O*NET Task ID 12577 | 1.0 |
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.O*NET Task ID 12584 | 1.0 |
Calculate etching time based on thickness of material to be removed from wafers or crystals.O*NET Task ID 12586 | 1.0 |
Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.O*NET Task ID 12575 | 0.5 |
Count, sort, and weigh processed items.O*NET Task ID 12585 | 0.5 |
Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.O*NET Task ID 12573 | 0.0 |
Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.O*NET Task ID 12576 | 0.0 |
Load and unload equipment chambers and transport finished product to storage or to area for further processing.O*NET Task ID 12578 | 0.0 |
Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.O*NET Task ID 12579 | 0.0 |
Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.O*NET Task ID 12580 | 0.0 |
Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.O*NET Task ID 12581 | 0.0 |
Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.O*NET Task ID 12582 | 0.0 |
Load semiconductor material into furnace.O*NET Task ID 12583 | 0.0 |
Inspect equipment for leaks, diagnose malfunctions, and request repairs.O*NET Task ID 12587 | 0.0 |
Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.O*NET Task ID 12588 | 0.0 |
Stamp, etch, or scribe identifying information on finished component according to specifications.O*NET Task ID 12589 | 0.0 |
Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.O*NET Task ID 12590 | 0.0 |
Scribe or separate wafers into dice.O*NET Task ID 12591 | 0.0 |
Connect reactor to computer, using hand tools and power tools.O*NET Task ID 12592 | 0.0 |
Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.O*NET Task ID 12593 | 0.0 |
Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.O*NET Task ID 12594 | 0.0 |
Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.O*NET Task ID 12595 | 0.0 |
Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.O*NET Task ID 12596 | 0.0 |
β = E1 + 0.5 × E2 · E1 = tasks where direct LLM access alone cuts time by at least 50%, E2 = tasks where software built on top of an LLM cuts time by at least 50%. Values take only 0 / 0.5 / 1.0.
Data sources & licenses — O*NET®, Eloundou et al. (2023): see full notices on the Credits page
All O*NET 31.0 task statements (17)
All O*NET 31.0 task statements for this occupation (English, as published; task type core or supplemental). Exposure values are not listed here; they are in the table above, next to each task statement as worded in the O*NET version each source used.
| Task (O*NET 31.0) | Type |
|---|---|
| Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles. | Core |
| Maintain processing, production, and inspection information and reports. | Core |
| Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures. | Core |
| Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands. | Core |
| Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations. | Core |
| Load and unload equipment chambers and transport finished product to storage or to area for further processing. | Core |
| Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers. | Core |
| Inspect equipment for leaks, diagnose malfunctions, and request repairs. | Core |
| Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area. | Supplemental |
| Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment. | Supplemental |
| Load semiconductor material into furnace. | Supplemental |
| Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals. | Supplemental |
| Count, sort, and weigh processed items. | Supplemental |
| Calculate etching time based on thickness of material to be removed from wafers or crystals. | Supplemental |
| Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment. | Supplemental |
| Stamp, etch, or scribe identifying information on finished component according to specifications. | Supplemental |
| Scribe or separate wafers into dice. | Supplemental |
1.35/ 3· Robot exposure index
Scale, basis and source
Each physical task is graded 0–3 by the setting in which robots that have been deployed, sold or demonstrated could do it (0 none · 1 purpose-built robot settings such as a fenced machine cell or a bottling line · 2 structured facilities such as a hospital pharmacy or a container port · 3 unstructured settings such as a private home or a construction site), and the grades are averaged by share of working time
Physical tasks among this occupation's O*NET 29.3 tasks
Anthropic estimated the grades and time shares with Claude Opus 5 using web search, as of 2026.
The robot exposure index is a different measure from the AI exposure figures on this site and cannot be added to or compared with them. It does not measure actual adoption or cost, and 0 also covers occupations with no physical tasks.
Tier of each physical task
Robot environment tiers (E0–E3)
E0 noneDetails
Rated not doable by robots that have been deployed, sold or demonstrated, even in a purpose-built setting
E1 purpose-built robot settingsDetails
Rated doable in a setting built around the machine, such as a fenced machine cell or a bottling line
E2 structured facilitiesDetails
Rated doable in a human work facility that an institution keeps to a working standard, such as a hospital pharmacy or a container port
E3 unstructured settingsDetails
Rated doable in a setting that no institution keeps to a working standard, such as a private home or a construction site
Only tasks classified as physical are listed; other tasks have no tier in the source.
| Task (O*NET 29.3) | Robot environment tier |
|---|---|
| Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles. | E2 structured facilities |
| Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures. | E2 structured facilities |
| Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands. | E2 structured facilities |
| Load and unload equipment chambers and transport finished product to storage or to area for further processing. | E2 structured facilities |
| Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area. | E1 purpose-built robot settings |
| Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers. | E1 purpose-built robot settings |
| Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications. | E2 structured facilities |
| Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment. | E2 structured facilities |
| Load semiconductor material into furnace. | E2 structured facilities |
| Count, sort, and weigh processed items. | E2 structured facilities |
| Inspect equipment for leaks, diagnose malfunctions, and request repairs. | E2 structured facilities |
| Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment. | E2 structured facilities |
| Stamp, etch, or scribe identifying information on finished component according to specifications. | E1 purpose-built robot settings |
| Scribe or separate wafers into dice. | E2 structured facilities |
| Connect reactor to computer, using hand tools and power tools. | E1 purpose-built robot settings |
| Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems. | E1 purpose-built robot settings |
Occupation information
Employment outlook (BLS)
- Employment, 2025
- 31K
- Projected employment, 2035
- 34K
- Change (2025–35)
- +8.2%
- Median annual wage, 2025
- $51,430
- Typical education needed for entry
- High school diploma or equivalent
Korea classification links (KSCO)
Links from the current release of the Korea Occupation Direct Crosswalk v1.1, made by AI Changing Work. Relation values are read from the O*NET-SOC occupation side.
| KSCO code | KSCO title | Relation | Status |
|---|---|---|---|
| 86331 | 전자 부품 제조 기계 조작원 | This occupation is narrower | confirmed |
| 23442 | 반도체공학 시험원 | Overlapping, not the same | confirmed |
| 86332 | 전자 제품 제조 기계 조작원 | Related, not a match | confirmed |
Relation and status definitions(kr-direct v1.1)
ILO occupational description
AI Changing Work links the ISCO-08 unit groups below to this occupation by applying the U.S. Bureau of Labor Statistics crosswalks (2018 SOC to 2010 SOC, 2010 SOC to ISCO-08) as published, without case-by-case selection; each link may be whole or partial.
- ISCO-08 8189Stationary Plant and Machine Operators Not Elsewhere Classified
Sources: ILO ISCO-08 — details: Credits
ESCO occupational vocabulary
Each entry below is matched to this occupation in the published ESCO-O*NET Crosswalk (version 1, 2022). The match types are that crosswalk's; the wording is AI Changing Work's.
- semiconductor processorESCO 8212.3.6Same scope
Semiconductor processors manufacture electronic semiconductors as well as semiconductor devices, such as microchips or integrated circuits (IC's). They may also repair, test, and review the products. Semiconductor processors work in cleanrooms and therefore need to wear a special lightweight outfit that fits over their clothing to prevent particles from contaminating their worksite.
- electronic equipment assemblerESCO 8212.3This occupation is narrower
Electronic equipment assemblers are responsible for the assembly of electronic equipment and systems. They assemble electronic components and wiring according to blueprints and assembly drawings. They may assist in quality inspection and equipment maintenance.
- printed circuit board assemblerESCO 8212.3.5Overlapping, not the same
Printed circuit board assemblers read blueprints and drawings to assemble printed circuit boards. They use hand- and automated soldering tools and machines to connect electronic components to the board.
Source: European Commission, DG EMPL — ESCO API 2026-08-08 (bridge v1.2.1)
License: CC BY 4.0 (EU Reuse Notice)
ESCO reuse terms and the modification notice are in Credits.
France classification links (ROME)
AI Changing Work's links between this occupation and ROME 4.0 job profiles, judged with AI models. Relations are read from this occupation's side. Links marked “provisional” were adopted on the judgments of two judges from the same model family (Claude) alone, or by an operator rule applied to their judgments, so they rest on weaker evidence than confirmed links.
| ROME code | ROME title (French) | Relation |
|---|---|---|
| H2603 | Opérateur / Opératrice sur machines automatisées en production électrique | This occupation is narrower |
Source: France Travail — Répertoire Opérationnel des Métiers et des Emplois (ROME 4.0), version 61, last updated 15 June 2026 (https://www.data.gouv.fr/datasets/repertoire-operationnel-des-metiers-et-des-emplois-rome). Licence Ouverte 2.0.
ROME codes and titles are reproduced unchanged; the links to O*NET-SOC occupations are AI Changing Work's own judgment and are not a France Travail correspondence.
(AI Changing Work link release: fr-direct v1)
Spain classification links (CNO-11)
AI Changing Work's links between this occupation and CNO-11 occupations, judged with AI models. Relations are read from this occupation's side.
| CNO-11 code | CNO-11 title (Spanish) | Relation |
|---|---|---|
| 8199 | Operadores de instalaciones y maquinaria fijas no clasificados bajo otros epígrafes | This occupation is narrowerprovisional |
Source: Instituto Nacional de Estadística (INE), National Classification of Occupations 2011 (CNO-11, Royal Decree 1591/2010) — www.ine.es · Licensed CC BY 4.0. CNO-11 codes and Spanish titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own judgment and are not an INE correspondence.
(AI Changing Work link release: es-direct v1)
Germany classification links (KldB)
AI Changing Work's links between this occupation and KldB occupations, judged with AI models. Relations are read from this occupation's side.
| KldB code | KldB title (German) | Relation |
|---|---|---|
| 26322 | Berufe in der Mikrosystemtechnik - fachlich ausgerichtete Tätigkeiten | This occupation is narrower |
Source: © Statistik der Bundesagentur für Arbeit — Klassifikation der Berufe 2010 – überarbeitete Fassung 2020, https://statistik.arbeitsagentur.de. KldB codes and titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own mapping (eigene Zuordnung) and are not a Bundesagentur für Arbeit correspondence.
(AI Changing Work link release: de-direct v1)
Japan classification links (JSCO)
AI Changing Work's links between this occupation and JSCO occupations, judged with AI models. Relations are read from this occupation's side.
| JSCO code | JSCO title (Japanese) | Relation |
|---|---|---|
| 542 | 電気機械器具組立従事者 | This occupation is narrower |
| 512 | 電気機械器具組立設備制御・監視員 | Related, not a match |
Source: Ministry of Internal Affairs and Communications (MIC), Japan Standard Occupational Classification (Dec. 2009, MIC Notification No. 555). JSCO codes and Japanese titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own judgment and are not a MIC correspondence.
(AI Changing Work link release: jp-direct v1)
Sources, licenses and AI Changing Work's modification and translation notices for this page: Credits & sources