Microsystems Engineers
Architecture and Engineering Occupations- Código O*NET-SOC
- 17-2199.06
Research, design, develop, or test microelectromechanical systems (MEMS) devices.
- Fuente de datos: BLSPublicado: 2026-08
Muy alto· relativa
BajoCuatro bandas relativasMuy altoValor por grupo ocupacional
Escala, base y fuente
Cuatro bandas relativas (Bajo / Moderado / Alto / Muy alto)
831 ocupaciones detalladas de la tabla de proyecciones de empleo de BLS. El valor se asigna por código de la National Employment Matrix (NEM), de modo que las ocupaciones que comparten un código NEM reciben la misma banda
- Fuente de datos: AnthropicPublicado: 2026-03
0,066
0,000Rango de los valores aquí recogidos0,745Valor por grupo ocupacional
Escala, base y fuente
Índice de exposición observada, 0–1 tal como se publica
Mapeado sobre tareas de O*NET
Publicado por ocupación SOC 2018; toda ocupación O*NET con el mismo código SOC 2018 recibe este valor
- Fuente de datos: ILOPublicado: 2025
0,30
0,09Rango de los valores aquí recogidos0,70Valor por grupo ocupacional
Escala, base y fuente
Índice de exposición a la IA generativa, 0–1 tal como se publica
Publicado por grupo primario ISCO-08. Vinculado a esta ocupación, total o parcialmente, aplicando tal como se publicaron las tablas de correspondencia de la U.S. Bureau of Labor Statistics (ISCO-08 a SOC 2010, SOC 2010 a SOC 2018)
Qué tipo de cifra publica esta fuente
La categoría de BLS es un rango relativo, no un nivel absoluto, y tampoco es una medición de primera mano: agrupa en cuatro bandas los rangos percentiles de la ocupación en varios estudios publicados. No es una previsión de empleo ni de salarios, no es una probabilidad de adopción y no distingue entre automatización y aumento.
Task-level exposure
Solo tareas expuestas31 tareas evaluadas · 23 tareas con β ≥ 0,5 (74,2%)
β = exposición directa (E1) + 0,5 × exposición con herramientas disponibles (E2), según la definición del repositorio de origen.
- Unidad de origen: tareas de O*NET 27.2 → código de ocupación de O*NET 31.0
- Todas las tareas puntuadas figuran en la lista de tareas de O*NET 31.0.
- Fuente
- OpenAI "GPTs are GPTs" exposure rubric
- Versión
- gh-main-0471612
- Licencia
- MIT License, Copyright (c) 2024 OpenAI
| Task (O*NET 30.2) | Claude.aiRaw / share % | APIRaw / share % |
|---|---|---|
Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements.17-2199.06 | 0.020066.7 | 0.0100100.0 |
Develop customer documentation, such as performance specifications, training manuals, or operating instructions.17-2199.06 | 0.010033.3 | 0.00000.0 |
Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement.17-2199.06 | 0.00000.0 | 0.00000.0 |
| Not observed on any surface — 28 task(s) — These tasks have no row in the source for this release. The 0 in the share row is a display-stage composition ratio; absence is what the — in the raw row states. | ||
Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology. | —0 | —0 |
Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes. | —0 | —0 |
Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements. | —0 | —0 |
Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software. | —0 | —0 |
Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting. | —0 | —0 |
Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints. | —0 | —0 |
Conduct analyses addressing issues such as failure, reliability, or yield improvement. | —0 | —0 |
Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications. | —0 | —0 |
Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays. | —0 | —0 |
Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications. | —0 | —0 |
Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems. | —0 | —0 |
Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers. | —0 | —0 |
Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications. | —0 | —0 |
Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints. | —0 | —0 |
Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing. | —0 | —0 |
Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability. | —0 | —0 |
Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining. | —0 | —0 |
Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests. | —0 | —0 |
Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes. | —0 | —0 |
Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology. | —0 | —0 |
Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing. | —0 | —0 |
Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software. | —0 | —0 |
Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology. | —0 | —0 |
Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining. | —0 | —0 |
Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices. | —0 | —0 |
Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines. | —0 | —0 |
Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications. | —0 | —0 |
Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy. | —0 | —0 |
Values in this tab are predicted labels, not observations. Eloundou et al. (2023) published two rating regimes — human raters and GPT-4 — and the β shown here is derived from the GPT-4 rater basis alone; the same task can take a different value under the other regime. The unit and the meaning differ from the observed shares (%) in the other tabs, so do not place them on the same axis.
| Task (O*NET 27.2) | βE1 + 0.5 × E2 |
|---|---|
Develop customer documentation, such as performance specifications, training manuals, or operating instructions.O*NET Task ID 16488 | 1.0 |
Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes.O*NET Task ID 16490 | 1.0 |
Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements.O*NET Task ID 16492 | 1.0 |
Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices.O*NET Task ID 19658 | 1.0 |
Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines.O*NET Task ID 19659 | 1.0 |
Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications.O*NET Task ID 19660 | 1.0 |
Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy.O*NET Task ID 19661 | 1.0 |
Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications.O*NET Task ID 16484 | 0.5 |
Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology.O*NET Task ID 16485 | 0.5 |
Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems.O*NET Task ID 16489 | 0.5 |
Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications.O*NET Task ID 16493 | 0.5 |
Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints.O*NET Task ID 16494 | 0.5 |
Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements.O*NET Task ID 16495 | 0.5 |
Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software.O*NET Task ID 16497 | 0.5 |
Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability.O*NET Task ID 16498 | 0.5 |
Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement.O*NET Task ID 16501 | 0.5 |
Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting.O*NET Task ID 16502 | 0.5 |
Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints.O*NET Task ID 16503 | 0.5 |
Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes.O*NET Task ID 16504 | 0.5 |
Conduct analyses addressing issues such as failure, reliability, or yield improvement.O*NET Task ID 16505 | 0.5 |
Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology.O*NET Task ID 16506 | 0.5 |
Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing.O*NET Task ID 16507 | 0.5 |
Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology.O*NET Task ID 19656 | 0.5 |
Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays.O*NET Task ID 16486 | 0.0 |
Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications.O*NET Task ID 16487 | 0.0 |
Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers.O*NET Task ID 16491 | 0.0 |
Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing.O*NET Task ID 16496 | 0.0 |
Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining.O*NET Task ID 16499 | 0.0 |
Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests.O*NET Task ID 16500 | 0.0 |
Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software.O*NET Task ID 16508 | 0.0 |
Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining.O*NET Task ID 19657 | 0.0 |
β = E1 + 0.5 × E2 · E1 = tasks where direct LLM access alone cuts time by at least 50%, E2 = tasks where software built on top of an LLM cuts time by at least 50%. Values take only 0 / 0.5 / 1.0.
Data sources & licenses — O*NET®, Anthropic Economic Index, Eloundou et al. (2023): see full notices on the Credits page
Todas las tareas de O*NET 31.0 (31)
Todas las tareas de O*NET 31.0 de esta ocupación (en inglés, tal como se publicaron; tipo de tarea principal o complementaria). Los valores de exposición no figuran en esta lista; están en la tabla de arriba, junto a cada tarea con la redacción de la versión de O*NET que usó cada fuente.
| Tarea (O*NET 31.0) | Tipo |
|---|---|
| Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology. | Principal |
| Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes. | Principal |
| Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements. | Principal |
| Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements. | Principal |
| Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software. | Principal |
| Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting. | Principal |
| Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints. | Principal |
| Conduct analyses addressing issues such as failure, reliability, or yield improvement. | Principal |
| Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications. | Complementaria |
| Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays. | Complementaria |
| Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications. | Complementaria |
| Develop customer documentation, such as performance specifications, training manuals, or operating instructions. | Complementaria |
| Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems. | Complementaria |
| Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers. | Complementaria |
| Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications. | Complementaria |
| Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints. | Complementaria |
| Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing. | Complementaria |
| Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability. | Complementaria |
| Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining. | Complementaria |
| Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests. | Complementaria |
| Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement. | Complementaria |
| Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes. | Complementaria |
| Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology. | Complementaria |
| Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing. | Complementaria |
| Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software. | Complementaria |
| Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology. | — |
| Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining. | — |
| Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices. | — |
| Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines. | — |
| Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications. | — |
| Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy. | — |
0,15/ 3· Índice de exposición a robots
Escala, base y fuente
Cada tarea física se califica de 0 a 3 según el entorno en el que robots ya implantados, vendidos o demostrados podrían realizarla (0 ninguno · 1 entornos diseñados para robots, como una celda de máquinas vallada o una línea de embotellado · 2 instalaciones estructuradas, como una farmacia hospitalaria o un puerto de contenedores · 3 entornos no estructurados, como un hogar particular o una obra de construcción), y las calificaciones se promedian según la proporción del tiempo de trabajo
Tareas físicas entre las tareas O*NET 29.3 de esta ocupación
Anthropic estimó las calificaciones y las proporciones de tiempo con Claude Opus 5 mediante búsqueda web (situación en 2026).
El índice de exposición a robots es una medida distinta de las cifras de exposición a la IA de este sitio y no puede sumarse a ellas ni compararse con ellas. No mide la adopción real ni el coste, y el 0 también incluye ocupaciones sin tareas físicas.
Calificación de cada tarea física
Niveles de entorno robótico (E0–E3)
E0 ningunoDetalles
Calificada como no realizable por robots que se han implantado, vendido o demostrado, ni siquiera en un entorno diseñado para robots
E1 entornos diseñados para robotsDetalles
Calificada como realizable en un entorno construido en torno a la máquina, como una celda de máquinas vallada o una línea de embotellado
E2 instalaciones estructuradasDetalles
Calificada como realizable en una instalación de trabajo de personas que una institución mantiene según un estándar de trabajo, como una farmacia hospitalaria o un puerto de contenedores
E3 entornos no estructuradosDetalles
Calificada como realizable en un entorno que ninguna institución mantiene según un estándar de trabajo, como un hogar particular o una obra de construcción
Solo se enumeran las tareas clasificadas como físicas; las demás tareas no tienen nivel en la fuente.
| Tarea (O*NET 29.3) | Nivel de entorno robótico |
|---|---|
| Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers. | E0 ninguno |
| Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes. | E1 entornos diseñados para robots |
| Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology. | E1 entornos diseñados para robots |
| Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software. | E1 entornos diseñados para robots |
| Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining. | E0 ninguno |
| Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy. | E1 entornos diseñados para robots |
Información ocupacional
Perspectivas de empleo (BLS)
Valores de todo el grupo SOC 17-2199 (Engineers, all other), no solo de esta ocupación O*NET.
- Empleo, 2025
- 167K
- Empleo proyectado, 2035
- 173K
- Variación (2025–35)
- +3,7%
- Salario anual mediano, 2025
- $122.930
- Formación habitual para acceder
- Bachelor's degree
Vínculos con la clasificación coreana (KSCO)
Vínculos de la versión vigente de Korea Occupation Direct Crosswalk v1.1, elaborado por AI Changing Work. Los valores de relación se leen desde la ocupación O*NET-SOC.
| Código KSCO | Nombre KSCO | Relación | Estado |
|---|---|---|---|
| 23439 | 그 외 전자공학 기술자 및 연구원 | Relacionada, no equivalente | confirmado |
Definiciones de relación y estado(kr-direct v1.1)
Descripción ocupacional de la OIT
AI Changing Work vincula a esta ocupación los grupos primarios de la ISCO-08 que figuran abajo aplicando, tal como se publicaron, las tablas de correspondencia de la Oficina de Estadísticas Laborales de EE. UU. (BLS) (SOC 2018 a SOC 2010, SOC 2010 a ISCO-08), sin selección caso por caso; cada vínculo puede ser total o parcial.
- ISCO-08 2149Engineering Professionals Not Elsewhere Classified
Ingenieros no clasificados bajo otros epígrafes
La definición, las tareas y los ejemplos que siguen son la descripción que hace la OIT de ese grupo primario, no de esta ocupación.
This unit group covers engineering professionals not classified elsewhere in Minor Group 214: Engineering Professionals (excluding Electrotechnology) or in Minor Group 215: Electrotechnology Engineers. For instance, the group includes those who conduct research and advise on or develop engineering procedures and solutions concerning workplace safety, biomedical engineering, optics, materials, nuclear power generation and explosives.
Tareas
- In such cases tasks would include -
- (a) applying knowledge of engineering to the design, development and evaluation of biological and health systems and products such as artificial organs, prostheses and instrumentation;
- (b) designing devices used in various medical procedures and imaging systems such as magnetic resonance imaging, and devices for automating insulin injections or controlling body functions;
- (c) designing components of optical instruments such as lenses, microscopes, telescopes, lasers, optical disc systems and other equipment that utilize the properties of light;
- (d) designing, testing, and coordinating the development of explosive ordnance material to meet military procurement specifications;
- (e) designing and overseeing construction and operation of nuclear reactors and power plants and nuclear fuels reprocessing and reclamation systems;
- (f) designing and developing nuclear equipment such as reactor cores, radiation shielding and associated instrumentation and control mechanisms;
- (g) assessing damage and providing calculations for marine salvage operations;
- (h) studying and advising on engineering aspects of particular manufacturing processes, such as those related to glass, ceramics, textiles, leather products, wood and printing;
- (i) identifying potential hazards and introducing safety procedures and devices.
Ocupaciones de ejemplo
Biomedical engineer · Explosive ordnance engineer · Marine salvage engineer · Materials engineer · Nuclear power generation engineer · Optical engineer · Quantity surveyor · Safety engineer
Sources: ILO ISCO-08 — details: Credits
Vocabulario ocupacional ESCO
Cada entrada de abajo está emparejada con esta ocupación en el ESCO-O*NET Crosswalk publicado (versión 1, 2022). Los tipos de correspondencia son los de esa tabla; la redacción es de AI Changing Work.
- ingeniero de microsistemas/ingeniera de microsistemasESCO 2152.1.7Mismo alcance
Los ingenieros de microsistemas se dedican a la investigación, el diseño, el desarrollo y la supervisión de la producción de sistemas microelectromecánicos (MEMS), que pueden integrarse en productos mecánicos, ópticos, acústicos y electrónicos.
Fuente: European Commission, DG EMPL — ESCO API 2026-08-08 (bridge v1.2.1)
Licencia: CC BY 4.0 (EU Reuse Notice)
ESCO reuse terms and the modification notice are in Credits.
Vínculos con la clasificación francesa (ROME)
Vínculos entre esta ocupación y fichas ROME 4.0, establecidos por AI Changing Work con modelos de IA. Las relaciones se leen desde el lado de esta ocupación. Los vínculos marcados como «provisional» se adoptaron basándose únicamente en los juicios de dos evaluadores de la misma familia de modelos (Claude), o mediante una regla del operador aplicada a esos juicios, por lo que se sustentan en evidencia más débil que los vínculos confirmados.
| Código ROME | Denominación ROME (francés) | Relación |
|---|---|---|
| H1206 | Ingénieur / Ingénieure R&D en industrie | Esta ocupación es más estrechaprovisional |
| K2402 | Ingénieur / Ingénieure de recherche scientifique | Relacionada, no equivalenteprovisional |
Source: France Travail — Répertoire Opérationnel des Métiers et des Emplois (ROME 4.0), version 61, last updated 15 June 2026 (https://www.data.gouv.fr/datasets/repertoire-operationnel-des-metiers-et-des-emplois-rome). Licence Ouverte 2.0.
ROME codes and titles are reproduced unchanged; the links to O*NET-SOC occupations are AI Changing Work's own judgment and are not a France Travail correspondence.
(AI Changing Work link release: fr-direct v1)
Vínculos con la clasificación española (CNO-11)
Vínculos entre esta ocupación y ocupaciones CNO-11, establecidos por AI Changing Work con modelos de IA. Las relaciones se leen desde el lado de esta ocupación.
| Código CNO-11 | Denominación CNO-11 (español) | Relación |
|---|---|---|
| 2442 | Ingenieros electrónicos | Esta ocupación es más estrecha |
| 2439 | Ingenieros no clasificados bajo otros epígrafes | Relacionada, no equivalente |
| 2472 | Ingenieros técnicos en electrónica | Relacionada, no equivalente |
Source: Instituto Nacional de Estadística (INE), National Classification of Occupations 2011 (CNO-11, Royal Decree 1591/2010) — www.ine.es · Licensed CC BY 4.0. CNO-11 codes and Spanish titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own judgment and are not an INE correspondence.
(AI Changing Work link release: es-direct v1)
Vínculos con la clasificación alemana (KldB)
Vínculos entre esta ocupación y ocupaciones KldB, establecidos por AI Changing Work con modelos de IA. Las relaciones se leen desde el lado de esta ocupación.
| Código KldB | Denominación KldB (alemán) | Relación |
|---|---|---|
| 26324 | Berufe in der Mikrosystemtechnik - hoch komplexe Tätigkeiten | Esta ocupación es más estrechaprovisional |
Source: © Statistik der Bundesagentur für Arbeit — Klassifikation der Berufe 2010 – überarbeitete Fassung 2020, https://statistik.arbeitsagentur.de. KldB codes and titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own mapping (eigene Zuordnung) and are not a Bundesagentur für Arbeit correspondence.
(AI Changing Work link release: de-direct v1)
Vínculos con la clasificación japonesa (JSCO)
Vínculos entre esta ocupación y ocupaciones JSCO, establecidos por AI Changing Work con modelos de IA. Las relaciones se leen desde el lado de esta ocupación.
| Código JSCO | Denominación JSCO (japonés) | Relación |
|---|---|---|
| 072 | 電気・電子・電気通信技術者（通信ネットワーク技術者を除く）（開発） | Esta ocupación es más estrecha |
| 082 | 電気・電子・電気通信技術者（通信ネットワーク技術者を除く）（開発を除く） | Relacionada, no equivalente |
Source: Ministry of Internal Affairs and Communications (MIC), Japan Standard Occupational Classification (Dec. 2009, MIC Notification No. 555). JSCO codes and Japanese titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own judgment and are not a MIC correspondence.
(AI Changing Work link release: jp-direct v1)
Fuentes de datos y licencias de esta página, y avisos de modificación y traducción de AI Changing Work: Créditos y fuentes