Microsystems Engineers
Architecture and Engineering Occupations- Código O*NET-SOC
- 17-2199.06
Research, design, develop, or test microelectromechanical systems (MEMS) devices.
- Fonte dos dados: BLSPublicado: 2026-08
Muito alto· relativa
BaixoQuatro faixas relativasMuito altoValor por grupo ocupacional
Escala, base e fonte
Quatro faixas relativas (Baixo / Moderado / Alto / Muito alto)
831 ocupações detalhadas da tabela de projeções de emprego do BLS. O valor é atribuído por código da National Employment Matrix (NEM), pelo que as ocupações que partilham um código NEM recebem a mesma banda
- Fonte dos dados: AnthropicPublicado: 2026-03
0,066
0,000Intervalo dos valores aqui apresentados0,745Valor por grupo ocupacional
Escala, base e fonte
Índice de exposição observada, 0–1 tal como publicado
Mapeado sobre tarefas O*NET
Publicado por ocupação SOC 2018; toda ocupação O*NET com o mesmo código SOC 2018 recebe este valor
- Fonte dos dados: ILOPublicado: 2025
0,30
0,09Intervalo dos valores aqui apresentados0,70Valor por grupo ocupacional
Escala, base e fonte
Índice de exposição à IA generativa, 0–1 tal como publicado
Publicado por grupo de base ISCO-08. Ligado a esta ocupação, total ou parcialmente, aplicando tal como publicadas as tabelas de correspondência do U.S. Bureau of Labor Statistics (ISCO-08 para SOC 2010, SOC 2010 para SOC 2018)
Que tipo de valor esta fonte publica
A categoria de BLS é uma posição relativa, não um nível absoluto, e também não é uma medição de primeira mão: agrupa em quatro faixas as posições percentis da ocupação em vários estudos publicados. Não é uma previsão de emprego ou de salários, não é uma probabilidade de adoção e não distingue automação de aumento.
Task-level exposure
Apenas tarefas expostas31 tarefas avaliadas · 23 tarefas com β ≥ 0,5 (74,2%)
β = exposição direta (E1) + 0,5 × exposição com ferramentas disponíveis (E2), segundo a definição do repositório de origem.
- Unidade de origem: tarefas do O*NET 27.2 → código de ocupação do O*NET 31.0
- Todas as tarefas pontuadas constam da lista de tarefas do O*NET 31.0.
- Fonte
- OpenAI "GPTs are GPTs" exposure rubric
- Versão
- gh-main-0471612
- Licença
- MIT License, Copyright (c) 2024 OpenAI
| Task (O*NET 30.2) | Claude.aiRaw / share % | APIRaw / share % |
|---|---|---|
Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements.17-2199.06 | 0.020066.7 | 0.0100100.0 |
Develop customer documentation, such as performance specifications, training manuals, or operating instructions.17-2199.06 | 0.010033.3 | 0.00000.0 |
Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement.17-2199.06 | 0.00000.0 | 0.00000.0 |
| Not observed on any surface — 28 task(s) — These tasks have no row in the source for this release. The 0 in the share row is a display-stage composition ratio; absence is what the — in the raw row states. | ||
Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology. | —0 | —0 |
Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes. | —0 | —0 |
Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements. | —0 | —0 |
Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software. | —0 | —0 |
Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting. | —0 | —0 |
Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints. | —0 | —0 |
Conduct analyses addressing issues such as failure, reliability, or yield improvement. | —0 | —0 |
Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications. | —0 | —0 |
Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays. | —0 | —0 |
Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications. | —0 | —0 |
Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems. | —0 | —0 |
Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers. | —0 | —0 |
Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications. | —0 | —0 |
Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints. | —0 | —0 |
Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing. | —0 | —0 |
Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability. | —0 | —0 |
Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining. | —0 | —0 |
Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests. | —0 | —0 |
Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes. | —0 | —0 |
Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology. | —0 | —0 |
Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing. | —0 | —0 |
Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software. | —0 | —0 |
Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology. | —0 | —0 |
Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining. | —0 | —0 |
Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices. | —0 | —0 |
Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines. | —0 | —0 |
Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications. | —0 | —0 |
Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy. | —0 | —0 |
Values in this tab are predicted labels, not observations. Eloundou et al. (2023) published two rating regimes — human raters and GPT-4 — and the β shown here is derived from the GPT-4 rater basis alone; the same task can take a different value under the other regime. The unit and the meaning differ from the observed shares (%) in the other tabs, so do not place them on the same axis.
| Task (O*NET 27.2) | βE1 + 0.5 × E2 |
|---|---|
Develop customer documentation, such as performance specifications, training manuals, or operating instructions.O*NET Task ID 16488 | 1.0 |
Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes.O*NET Task ID 16490 | 1.0 |
Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements.O*NET Task ID 16492 | 1.0 |
Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices.O*NET Task ID 19658 | 1.0 |
Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines.O*NET Task ID 19659 | 1.0 |
Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications.O*NET Task ID 19660 | 1.0 |
Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy.O*NET Task ID 19661 | 1.0 |
Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications.O*NET Task ID 16484 | 0.5 |
Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology.O*NET Task ID 16485 | 0.5 |
Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems.O*NET Task ID 16489 | 0.5 |
Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications.O*NET Task ID 16493 | 0.5 |
Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints.O*NET Task ID 16494 | 0.5 |
Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements.O*NET Task ID 16495 | 0.5 |
Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software.O*NET Task ID 16497 | 0.5 |
Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability.O*NET Task ID 16498 | 0.5 |
Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement.O*NET Task ID 16501 | 0.5 |
Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting.O*NET Task ID 16502 | 0.5 |
Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints.O*NET Task ID 16503 | 0.5 |
Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes.O*NET Task ID 16504 | 0.5 |
Conduct analyses addressing issues such as failure, reliability, or yield improvement.O*NET Task ID 16505 | 0.5 |
Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology.O*NET Task ID 16506 | 0.5 |
Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing.O*NET Task ID 16507 | 0.5 |
Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology.O*NET Task ID 19656 | 0.5 |
Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays.O*NET Task ID 16486 | 0.0 |
Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications.O*NET Task ID 16487 | 0.0 |
Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers.O*NET Task ID 16491 | 0.0 |
Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing.O*NET Task ID 16496 | 0.0 |
Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining.O*NET Task ID 16499 | 0.0 |
Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests.O*NET Task ID 16500 | 0.0 |
Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software.O*NET Task ID 16508 | 0.0 |
Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining.O*NET Task ID 19657 | 0.0 |
β = E1 + 0.5 × E2 · E1 = tasks where direct LLM access alone cuts time by at least 50%, E2 = tasks where software built on top of an LLM cuts time by at least 50%. Values take only 0 / 0.5 / 1.0.
Data sources & licenses — O*NET®, Anthropic Economic Index, Eloundou et al. (2023): see full notices on the Credits page
Todas as tarefas do O*NET 31.0 (31)
Todas as tarefas do O*NET 31.0 desta ocupação (em inglês, como publicadas; tipo de tarefa principal ou complementar). Os valores de exposição não constam desta lista; estão na tabela acima, ao lado de cada tarefa na redação da versão do O*NET usada por cada fonte.
| Tarefa (O*NET 31.0) | Tipo |
|---|---|
| Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology. | Principal |
| Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes. | Principal |
| Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements. | Principal |
| Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements. | Principal |
| Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software. | Principal |
| Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting. | Principal |
| Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints. | Principal |
| Conduct analyses addressing issues such as failure, reliability, or yield improvement. | Principal |
| Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications. | Complementar |
| Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays. | Complementar |
| Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications. | Complementar |
| Develop customer documentation, such as performance specifications, training manuals, or operating instructions. | Complementar |
| Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems. | Complementar |
| Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers. | Complementar |
| Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications. | Complementar |
| Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints. | Complementar |
| Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing. | Complementar |
| Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability. | Complementar |
| Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining. | Complementar |
| Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests. | Complementar |
| Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement. | Complementar |
| Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes. | Complementar |
| Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology. | Complementar |
| Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing. | Complementar |
| Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software. | Complementar |
| Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology. | — |
| Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining. | — |
| Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices. | — |
| Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines. | — |
| Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications. | — |
| Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy. | — |
0,15/ 3· Índice de exposição a robôs
Escala, base e fonte
Cada tarefa física recebe uma nota de 0 a 3 conforme o ambiente em que robôs já implantados, vendidos ou demonstrados poderiam realizá-la (0 nenhum · 1 ambientes feitos para robôs, como uma célula de máquinas cercada ou uma linha de engarrafamento · 2 instalações estruturadas, como uma farmácia hospitalar ou um porto de contêineres · 3 ambientes não estruturados, como uma residência particular ou um canteiro de obras), e as notas são promediadas pela parcela do tempo de trabalho
Tarefas físicas entre as tarefas O*NET 29.3 desta ocupação
A Anthropic estimou as notas e as parcelas de tempo com o Claude Opus 5 usando pesquisa na web (situação em 2026).
O índice de exposição a robôs é uma medida diferente dos números de exposição à IA deste site e não pode ser somado a eles nem comparado com eles. Não mede a adoção real nem o custo, e 0 também abrange ocupações sem tarefas físicas.
Nota de cada tarefa física
Níveis de ambiente robótico (E0–E3)
E0 nenhumDetalhes
Avaliada como não realizável por robôs que foram implantados, vendidos ou demonstrados, nem mesmo em um ambiente feito para robôs
E1 ambientes feitos para robôsDetalhes
Avaliada como realizável em um ambiente construído em torno da máquina, como uma célula de máquinas cercada ou uma linha de engarrafamento
E2 instalações estruturadasDetalhes
Avaliada como realizável em uma instalação de trabalho de pessoas que uma instituição mantém em um padrão de trabalho, como uma farmácia hospitalar ou um porto de contêineres
E3 ambientes não estruturadosDetalhes
Avaliada como realizável em um ambiente que nenhuma instituição mantém em um padrão de trabalho, como uma residência particular ou um canteiro de obras
Apenas as tarefas classificadas como físicas são listadas; as demais tarefas não têm nível na fonte.
| Tarefa (O*NET 29.3) | Nível de ambiente robótico |
|---|---|
| Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers. | E0 nenhum |
| Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes. | E1 ambientes feitos para robôs |
| Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology. | E1 ambientes feitos para robôs |
| Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software. | E1 ambientes feitos para robôs |
| Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining. | E0 nenhum |
| Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy. | E1 ambientes feitos para robôs |
Informação ocupacional
Perspetivas de emprego (BLS)
Valores de todo o grupo SOC 17-2199 (Engineers, all other), não apenas desta ocupação O*NET.
- Emprego, 2025
- 167K
- Emprego projetado, 2035
- 173K
- Variação (2025–35)
- +3,7%
- Salário anual mediano, 2025
- $122.930
- Escolaridade habitual para ingresso
- Bachelor's degree
Ligações à classificação coreana (KSCO)
Ligações da versão atual de Korea Occupation Direct Crosswalk v1.1, elaborado pela AI Changing Work. Os valores de relação são lidos a partir da ocupação O*NET-SOC.
| Código KSCO | Nome KSCO | Relação | Estado |
|---|---|---|---|
| 23439 | 그 외 전자공학 기술자 및 연구원 | Relacionada, não correspondente | confirmado |
Definições de relação e estado(kr-direct v1.1)
Descrição ocupacional da OIT
A AI Changing Work vincula a esta ocupação os grupos de base da ISCO-08 abaixo aplicando, tal como publicadas, as tabelas de correspondência do Bureau of Labor Statistics dos EUA (BLS) (SOC 2018 para SOC 2010, SOC 2010 para ISCO-08), sem seleção caso a caso; cada vínculo pode ser total ou parcial.
- ISCO-08 2149Engineering Professionals Not Elsewhere Classified
Outros engenheiros (excluindo de electrotecnologia)
Fonte: European Commission, DG EMPL — ESCO API 2026-08-08 (bridge v1.2.1)
Licença: CC BY 4.0 (EU Reuse Notice)
A definição, as tarefas e os exemplos abaixo são a descrição da OIT para esse grupo de base, não para esta ocupação.
This unit group covers engineering professionals not classified elsewhere in Minor Group 214: Engineering Professionals (excluding Electrotechnology) or in Minor Group 215: Electrotechnology Engineers. For instance, the group includes those who conduct research and advise on or develop engineering procedures and solutions concerning workplace safety, biomedical engineering, optics, materials, nuclear power generation and explosives.
Tarefas
- In such cases tasks would include -
- (a) applying knowledge of engineering to the design, development and evaluation of biological and health systems and products such as artificial organs, prostheses and instrumentation;
- (b) designing devices used in various medical procedures and imaging systems such as magnetic resonance imaging, and devices for automating insulin injections or controlling body functions;
- (c) designing components of optical instruments such as lenses, microscopes, telescopes, lasers, optical disc systems and other equipment that utilize the properties of light;
- (d) designing, testing, and coordinating the development of explosive ordnance material to meet military procurement specifications;
- (e) designing and overseeing construction and operation of nuclear reactors and power plants and nuclear fuels reprocessing and reclamation systems;
- (f) designing and developing nuclear equipment such as reactor cores, radiation shielding and associated instrumentation and control mechanisms;
- (g) assessing damage and providing calculations for marine salvage operations;
- (h) studying and advising on engineering aspects of particular manufacturing processes, such as those related to glass, ceramics, textiles, leather products, wood and printing;
- (i) identifying potential hazards and introducing safety procedures and devices.
Ocupações de exemplo
Biomedical engineer · Explosive ordnance engineer · Marine salvage engineer · Materials engineer · Nuclear power generation engineer · Optical engineer · Quantity surveyor · Safety engineer
Sources: ILO ISCO-08 — details: Credits
Vocabulário ocupacional ESCO
Cada entrada abaixo está associada a esta ocupação no ESCO-O*NET Crosswalk publicado (versão 1, 2022). Os tipos de correspondência são os dessa tabela; a redação é da AI Changing Work.
- Engenheiro de microsistemas/Engenheira de microsistemasESCO 2152.1.7Mesmo âmbito
Os engenheiros de microssistemas investigam, concebem, desenvolvem e supervisionam a produção de sistemas microeletromecânicos (MEMS), que podem ser integrados em produtos mecânicos, óticos, acústicos e eletrónicos.
Fonte: European Commission, DG EMPL — ESCO API 2026-08-08 (bridge v1.2.1)
Licença: CC BY 4.0 (EU Reuse Notice)
ESCO reuse terms and the modification notice are in Credits.
Ligações à classificação francesa (ROME)
Ligações entre esta ocupação e fichas ROME 4.0, estabelecidas pela AI Changing Work com modelos de IA. As relações leem-se do lado desta ocupação. As ligações marcadas como «provisório» foram adotadas apenas com base nos julgamentos de dois avaliadores da mesma família de modelos (Claude), ou por uma regra do operador aplicada a esses julgamentos, pelo que se apoiam em evidências mais fracas do que as ligações confirmadas.
| Código ROME | Designação ROME (francês) | Relação |
|---|---|---|
| H1206 | Ingénieur / Ingénieure R&D en industrie | Esta ocupação é mais restritaprovisório |
| K2402 | Ingénieur / Ingénieure de recherche scientifique | Relacionada, não correspondenteprovisório |
Source: France Travail — Répertoire Opérationnel des Métiers et des Emplois (ROME 4.0), version 61, last updated 15 June 2026 (https://www.data.gouv.fr/datasets/repertoire-operationnel-des-metiers-et-des-emplois-rome). Licence Ouverte 2.0.
ROME codes and titles are reproduced unchanged; the links to O*NET-SOC occupations are AI Changing Work's own judgment and are not a France Travail correspondence.
(AI Changing Work link release: fr-direct v1)
Ligações à classificação espanhola (CNO-11)
Ligações entre esta ocupação e ocupações CNO-11, estabelecidas pela AI Changing Work com modelos de IA. As relações leem-se do lado desta ocupação.
| Código CNO-11 | Designação CNO-11 (espanhol) | Relação |
|---|---|---|
| 2442 | Ingenieros electrónicos | Esta ocupação é mais restrita |
| 2439 | Ingenieros no clasificados bajo otros epígrafes | Relacionada, não correspondente |
| 2472 | Ingenieros técnicos en electrónica | Relacionada, não correspondente |
Source: Instituto Nacional de Estadística (INE), National Classification of Occupations 2011 (CNO-11, Royal Decree 1591/2010) — www.ine.es · Licensed CC BY 4.0. CNO-11 codes and Spanish titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own judgment and are not an INE correspondence.
(AI Changing Work link release: es-direct v1)
Ligações à classificação alemã (KldB)
Ligações entre esta ocupação e ocupações KldB, estabelecidas pela AI Changing Work com modelos de IA. As relações leem-se do lado desta ocupação.
| Código KldB | Designação KldB (alemão) | Relação |
|---|---|---|
| 26324 | Berufe in der Mikrosystemtechnik - hoch komplexe Tätigkeiten | Esta ocupação é mais restritaprovisório |
Source: © Statistik der Bundesagentur für Arbeit — Klassifikation der Berufe 2010 – überarbeitete Fassung 2020, https://statistik.arbeitsagentur.de. KldB codes and titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own mapping (eigene Zuordnung) and are not a Bundesagentur für Arbeit correspondence.
(AI Changing Work link release: de-direct v1)
Ligações à classificação japonesa (JSCO)
Ligações entre esta ocupação e ocupações JSCO, estabelecidas pela AI Changing Work com modelos de IA. As relações leem-se do lado desta ocupação.
| Código JSCO | Designação JSCO (japonês) | Relação |
|---|---|---|
| 072 | 電気・電子・電気通信技術者（通信ネットワーク技術者を除く）（開発） | Esta ocupação é mais restrita |
| 082 | 電気・電子・電気通信技術者（通信ネットワーク技術者を除く）（開発を除く） | Relacionada, não correspondente |
Source: Ministry of Internal Affairs and Communications (MIC), Japan Standard Occupational Classification (Dec. 2009, MIC Notification No. 555). JSCO codes and Japanese titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own judgment and are not a MIC correspondence.
(AI Changing Work link release: jp-direct v1)
Fontes de dados e licenças desta página, e avisos de modificação e tradução da AI Changing Work: Créditos e fontes