O*NET-SOC 代码
17-2199.06

Research, design, develop, or test microelectromechanical systems (MEMS) devices.

职业名称和任务陈述按其发布时的英文原文显示。标签(包括任务类型)为译文。

AI暴露度

  • 数据来源: BLS发布时间: 2026-08

    很高· 相对

    低四级相对区间很高

    职业群单位数值

    尺度 · 母数 · 来源

    四级相对类别(低 / 中等 / 高 / 很高)

    以BLS就业预测表中831个细分职业为基数。取值按 NEM(全国就业矩阵)代码给定,因此共用同一 NEM 代码的职业得到相同分档

    来源数据集(XLSX 文件下载)

  • 数据来源: Anthropic发布时间: 2026-03

    0.066

    0.000此处所载数值的范围0.745

    职业群单位数值

    尺度 · 母数 · 来源

    观测暴露度指数,按发布原值0–1

    以O*NET任务映射为基准

    按 SOC 2018 职业发布的数值;具有相同 SOC 2018 代码的所有 O*NET 职业均显示此值

    来源数据集(CSV 文件下载)

  • 数据来源: ILO发布时间: 2025

    0.30

    0.09此处所载数值的范围0.70

    职业群单位数值

    尺度 · 母数 · 来源

    生成式AI暴露度指数,按发布原值0–1

    按 ISCO-08 细类(4 位)发布的数值。按原样应用美国劳工统计局(BLS)的官方对照表(ISCO-08→2010 SOC、2010 SOC→2018 SOC)关联到本职业,对应关系为全部或部分对应

    来源数据集(PDF 文件下载)

该来源发布的是什么性质的数值

BLS的类别是相对排位而非绝对水平,也不是一手测量:它把多项已发表研究给出的职业百分位排名归并为四个等级。它不是就业或工资预测,不是采用概率,也不区分自动化与增强。

AI 暴露度(OpenAI 评分标准)

已评分任务 31 项 · β ≥ 0.5 的任务 23 项(74.2%)

β = 直接暴露(E1)+ 0.5 × 借助工具时的暴露(E2),依据原始代码库的定义。

  • 原始单位:O*NET 27.2 任务 → O*NET 31.0 职业代码
  • 所有已评分任务均在 O*NET 31.0 任务列表中。
来源
OpenAI "GPTs are GPTs" exposure rubric
版本
gh-main-0471612
许可
MIT License, Copyright (c) 2024 OpenAI

任务

来自 O*NET® 31.0 Database 的任务陈述,核心任务在前。

任务类型β(OpenAI)
Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology.核心0.5
Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes.核心1
Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements.核心1
Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements.核心0.5
Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software.核心0.5
Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting.核心0.5
Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints.核心0.5
Conduct analyses addressing issues such as failure, reliability, or yield improvement.核心0.5
Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications.补充0.5
Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays.补充0
Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications.补充0
Develop customer documentation, such as performance specifications, training manuals, or operating instructions.补充1
Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems.补充0.5
Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers.补充0
Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications.补充0.5
Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints.补充0.5
Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing.补充0
Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability.补充0.5
Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining.补充0
Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests.补充0
Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement.补充0.5
Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes.补充0.5
Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology.补充0.5
Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing.补充0.5
Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software.补充0
Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology.—0.5
Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining.—0
Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices.—1
Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines.—1
Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications.—1
Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy.—1

职业信息

来源与署名

This page includes information from the O*NET® 31.0 Database (https://www.onetcenter.org/database.html) by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license (https://creativecommons.org/licenses/by/4.0/). O*NET® is a trademark of USDOL/ETA. AI Changing Work has modified all or some of this information: the O*NET-SOC code, title and task statements are reproduced in English without change; task-type labels are shown in the page's language and tasks are listed core first; any Korean occupation title shown on the Korean-language page is AI Changing Work's translation; any KSCO-8 unit groups linked to this occupation were paired with it by AI Changing Work's judgment, and the relation labels and statuses are AI Changing Work's additions. USDOL/ETA has not approved, endorsed, or tested these modifications.

Any AI exposure figures on this page are published by third parties, not by AI Changing Work, and none is part of the O*NET information. OpenAI publishes task-level scores (MIT License) for O*NET 27.2 task statements; each is shown next to the O*NET 31.0 task statement with the same task ID, whose wording can differ from the 27.2 statement that was scored. OpenAI also publishes occupation-level scores for O*NET-SOC codes in the same release, and any such score is shown on the O*NET occupation with the same code. Anthropic publishes an observed exposure index in the Anthropic Economic Index (CC-BY), and the U.S. Bureau of Labor Statistics publishes relative AI exposure categories (public domain); both are published per SOC code, and each value is shown on every O*NET occupation with that code. The International Labour Organization publishes a generative AI exposure index in ILO Working Paper 140 (CC BY 4.0) for ISCO-08 unit groups; AI Changing Work links those groups to O*NET occupations by applying the U.S. Bureau of Labor Statistics ISCO-08 to 2010 SOC and 2010 SOC to 2018 SOC crosswalks as published, without case-by-case selection, and these crosswalks match many groups only in part. Where several unit groups are linked, each group's published value is listed, and any summary shows only the lowest and highest of those values with the number of groups; no exposure figure is averaged or recalculated. Any employment figures are published by the U.S. Bureau of Labor Statistics for the SOC group containing this occupation. Each source is credited where its figures are shown.

O*NET OnLine: 17-2199.06 Microsystems Engineers

KSCO 코드·명칭: 한국표준직업분류(제8차 개정) — 통계청 고시 제2024-328호 (2024-07-01 고시, 2025-01-01 시행). 저작권법 제7조 제2호의 고시 항목이다. 명칭 표기(가운뎃점·띄어쓰기)는 해설서 2차 정오 반영판의 표기를 따랐으며, 고시 항목표와는 18개 명칭에서 가운뎃점 글리프나 띄어쓰기만 다르다. 통계청은 2025년 10월 국가데이터처로 개편되었다. 이 페이지의 KSCO 연결은 통계청·국가데이터처의 공식 연계표가 아니다.

完整署名与许可