Semiconductor Processing Technicians
Production Occupations- O*NET-SOC 代码
- 51-9141.00
Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.
- 数据来源: BLS发布时间: 2026-08
中等· 相对
低四级相对区间很高职业群单位数值
尺度 · 母数 · 来源
四级相对类别（低 / 中等 / 高 / 很高）
以BLS就业预测表中831个细分职业为基数。取值按 NEM（全国就业矩阵）代码给定，因此共用同一 NEM 代码的职业得到相同分档
- 数据来源: Anthropic发布时间: 2026-03
0.000
0.000此处所载数值的范围0.745尺度 · 母数 · 来源
- 数据来源: OpenAI发布时间: 2023
0.063
0.000此处所载数值的范围0.844尺度 · 母数 · 来源
该来源发布的是什么性质的数值
BLS的类别是相对排位而非绝对水平，也不是一手测量：它把多项已发表研究给出的职业百分位排名归并为四个等级。它不是就业或工资预测，不是采用概率，也不区分自动化与增强。
Task-level exposure
显示隐藏的 18 项工作已评分任务 24 项 · β ≥ 0.5 的任务 6 项（25.0%）
β = 直接暴露（E1）+ 0.5 × 借助工具时的暴露（E2），依据原始代码库的定义。
- 原始单位：O*NET 27.2 任务 → O*NET 31.0 职业代码
- 已评分任务中有 7 项不在 O*NET 31.0 任务列表中，其分数按 O*NET 27.2 的发布值保留。
- 来源
- OpenAI "GPTs are GPTs" exposure rubric
- 版本
- gh-main-0471612
- 许可
- MIT License, Copyright (c) 2024 OpenAI
Values in this tab are predicted labels, not observations. Eloundou et al. (2023) published two rating regimes — human raters and GPT-4 — and the β shown here is derived from the GPT-4 rater basis alone; the same task can take a different value under the other regime.
| Task (O*NET 27.2) | βE1 + 0.5 × E2 |
|---|---|
Maintain processing, production, and inspection information and reports.O*NET Task ID 12574 | 1.0 |
Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.O*NET Task ID 12577 | 1.0 |
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.O*NET Task ID 12584 | 1.0 |
Calculate etching time based on thickness of material to be removed from wafers or crystals.O*NET Task ID 12586 | 1.0 |
Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.O*NET Task ID 12575 | 0.5 |
Count, sort, and weigh processed items.O*NET Task ID 12585 | 0.5 |
β = E1 + 0.5 × E2 · E1 = tasks where direct LLM access alone cuts time by at least 50%, E2 = tasks where software built on top of an LLM cuts time by at least 50%. Values take only 0 / 0.5 / 1.0.
Data sources & licenses — O*NET®, Eloundou et al. (2023): see full notices on the Credits page
O*NET 31.0 全部任务（17 项）
本职业在 O*NET 31.0 中的全部任务（英文原文；任务类型为核心或补充）。暴露值不列在此清单中，而在上方表格里，位于各来源所用 O*NET 版本的任务表述旁。
| 任务（O*NET 31.0） | 类型 |
|---|---|
| Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles. | 核心 |
| Maintain processing, production, and inspection information and reports. | 核心 |
| Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures. | 核心 |
| Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands. | 核心 |
| Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations. | 核心 |
| Load and unload equipment chambers and transport finished product to storage or to area for further processing. | 核心 |
| Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers. | 核心 |
| Inspect equipment for leaks, diagnose malfunctions, and request repairs. | 核心 |
| Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area. | 补充 |
| Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment. | 补充 |
| Load semiconductor material into furnace. | 补充 |
| Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals. | 补充 |
| Count, sort, and weigh processed items. | 补充 |
| Calculate etching time based on thickness of material to be removed from wafers or crystals. | 补充 |
| Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment. | 补充 |
| Stamp, etch, or scribe identifying information on finished component according to specifications. | 补充 |
| Scribe or separate wafers into dice. | 补充 |
1.35/ 3· 机器人暴露指数
尺度 · 母数 · 来源
对每项体力任务，按已实际部署、销售或演示的机器人能够完成它的环境评定 0–3 级（0 不可 · 1 围栏式机器单元、灌装线等机器人专用设施 · 2 医院药房、集装箱港口等受管理的设施 · 3 私人住宅、建筑工地等非结构化环境），再按工作时间占比求平均
以该职业 O*NET 29.3 任务中的体力任务为准
等级与时间占比由 Anthropic 使用 Claude Opus 5（网络搜索）估算（截至 2026 年）。
机器人暴露指数与本站的 AI 暴露度是不同的指标，不能相加或相互比较。该指数不代表实际采用情况或成本竞争力，0 也包括没有体力任务的职业。
每项体力任务的等级
机器人环境等级（E0–E3）
E0 机器人不可详情
评定为已实际部署、销售或演示的机器人即使在机器人专用设施中也无法完成
E1 机器人专用设施详情
评定为可在围绕机器搭建的设施中完成，例如围栏式机器单元或灌装线
E2 受管理的设施详情
评定为可在由机构按工作标准维护的人类工作设施中完成，例如医院药房或集装箱港口
E3 非结构化环境详情
评定为可在没有机构按工作标准维护的环境中完成，例如私人住宅或建筑工地
仅列出被归类为体力任务的任务；其他任务在来源中没有等级。
| 任务（O*NET 29.3） | 机器人环境等级 |
|---|---|
| Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles. | E2 受管理的设施 |
| Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures. | E2 受管理的设施 |
| Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands. | E2 受管理的设施 |
| Load and unload equipment chambers and transport finished product to storage or to area for further processing. | E2 受管理的设施 |
| Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area. | E1 机器人专用设施 |
| Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers. | E1 机器人专用设施 |
| Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications. | E2 受管理的设施 |
| Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment. | E2 受管理的设施 |
| Load semiconductor material into furnace. | E2 受管理的设施 |
| Count, sort, and weigh processed items. | E2 受管理的设施 |
| Inspect equipment for leaks, diagnose malfunctions, and request repairs. | E2 受管理的设施 |
| Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment. | E2 受管理的设施 |
| Stamp, etch, or scribe identifying information on finished component according to specifications. | E1 机器人专用设施 |
| Scribe or separate wafers into dice. | E2 受管理的设施 |
| Connect reactor to computer, using hand tools and power tools. | E1 机器人专用设施 |
| Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems. | E1 机器人专用设施 |
职业信息
就业展望（BLS）
- 就业人数，2025
- 31K
- 预计就业人数，2035
- 34K
- 变化 (2025–35)
- +8.2%
- 年薪中位数，2025
- $51,430
- 入职通常所需学历
- High school diploma or equivalent
韩国职业分类关联（KSCO）
来自 AI Changing Work 制作的 Korea Occupation Direct Crosswalk v1.1 当前版本的关联。关系值从 O*NET-SOC 职业一侧解读。
| KSCO 代码 | KSCO 名称 | 关系 | 状态 |
|---|---|---|---|
| 86331 | 전자 부품 제조 기계 조작원 | 本职业范围更窄 | 已确认 |
| 23442 | 반도체공학 시험원 | 有重叠，但不相同 | 已确认 |
| 86332 | 전자 제품 제조 기계 조작원 | 相关，但不对应 | 已确认 |
关系与状态的定义(kr-direct v1.1)
国际劳工组织（ILO）职业说明
以下 ISCO-08 职业组由 AI Changing Work 原样套用美国劳工统计局（BLS）发布的对照表（2018 SOC→2010 SOC、2010 SOC→ISCO-08）、不逐案取舍，与本职业相关联；每项关联可能是完全对应，也可能是部分对应。
- ISCO-08 8189Stationary Plant and Machine Operators Not Elsewhere Classified
其他未列明的固定装置和机器操作工
自行翻译
自行翻译 · 非 ISCO 官方词汇 — 未经国际劳工组织审核。
Sources: ILO ISCO-08 — details: Credits
ESCO 职业词汇
以下每一项都是在已公开的ESCO-O*NET Crosswalk（第 1 版，2022 年）中与本职业逐项对应的。对应类型出自该对照表；表述出自 AI Changing Work。
- semiconductor processorESCO 8212.3.6范围相同
Semiconductor processors manufacture electronic semiconductors as well as semiconductor devices, such as microchips or integrated circuits (IC's). They may also repair, test, and review the products. Semiconductor processors work in cleanrooms and therefore need to wear a special lightweight outfit that fits over their clothing to prevent particles from contaminating their worksite.
- electronic equipment assemblerESCO 8212.3本职业范围更窄
Electronic equipment assemblers are responsible for the assembly of electronic equipment and systems. They assemble electronic components and wiring according to blueprints and assembly drawings. They may assist in quality inspection and equipment maintenance.
- printed circuit board assemblerESCO 8212.3.5有重叠，但不相同
Printed circuit board assemblers read blueprints and drawings to assemble printed circuit boards. They use hand- and automated soldering tools and machines to connect electronic components to the board.
来源: European Commission, DG EMPL — ESCO API 2026-08-08 (bridge v1.2.1)
许可: CC BY 4.0 (EU Reuse Notice)
ESCO reuse terms and the modification notice are in Credits.
法国职业分类关联（ROME）
本职业与 ROME 4.0 职业条目（fiche）之间的关联，由 AI Changing Work 借助 AI 模型判定。关系从本职业一侧解读。标为「暂定」的关联仅凭同一模型系列（Claude）两位判定者的判定采纳，或对其判定适用运营方规则后采纳，因此其依据弱于已确认的关联。
| ROME 代码 | ROME 名称（法语） | 关系 |
|---|---|---|
| H2603 | Opérateur / Opératrice sur machines automatisées en production électrique | 本职业范围更窄 |
Source: France Travail — Répertoire Opérationnel des Métiers et des Emplois (ROME 4.0), version 61, last updated 15 June 2026 (https://www.data.gouv.fr/datasets/repertoire-operationnel-des-metiers-et-des-emplois-rome). Licence Ouverte 2.0.
ROME codes and titles are reproduced unchanged; the links to O*NET-SOC occupations are AI Changing Work's own judgment and are not a France Travail correspondence.
(AI Changing Work link release: fr-direct v1)
西班牙职业分类关联（CNO-11）
本职业与 CNO-11 职业之间的关联，由 AI Changing Work 借助 AI 模型判定。关系从本职业一侧解读。
| CNO-11 代码 | CNO-11 名称（西班牙语） | 关系 |
|---|---|---|
| 8199 | Operadores de instalaciones y maquinaria fijas no clasificados bajo otros epígrafes | 本职业范围更窄暂定 |
Source: Instituto Nacional de Estadística (INE), National Classification of Occupations 2011 (CNO-11, Royal Decree 1591/2010) — www.ine.es · Licensed CC BY 4.0. CNO-11 codes and Spanish titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own judgment and are not an INE correspondence.
(AI Changing Work link release: es-direct v1)
德国职业分类关联（KldB）
本职业与 KldB 职业之间的关联，由 AI Changing Work 借助 AI 模型判定。关系从本职业一侧解读。
| KldB 代码 | KldB 名称（德语） | 关系 |
|---|---|---|
| 26322 | Berufe in der Mikrosystemtechnik - fachlich ausgerichtete Tätigkeiten | 本职业范围更窄 |
Source: © Statistik der Bundesagentur für Arbeit — Klassifikation der Berufe 2010 – überarbeitete Fassung 2020, https://statistik.arbeitsagentur.de. KldB codes and titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own mapping (eigene Zuordnung) and are not a Bundesagentur für Arbeit correspondence.
(AI Changing Work link release: de-direct v1)
日本职业分类关联（JSCO）
本职业与 JSCO 职业之间的关联，由 AI Changing Work 借助 AI 模型判定。关系从本职业一侧解读。
| JSCO 代码 | JSCO 名称（日语） | 关系 |
|---|---|---|
| 542 | 電気機械器具組立従事者 | 本职业范围更窄 |
| 512 | 電気機械器具組立設備制御・監視員 | 相关，但不对应 |
Source: Ministry of Internal Affairs and Communications (MIC), Japan Standard Occupational Classification (Dec. 2009, MIC Notification No. 555). JSCO codes and Japanese titles are reproduced unchanged; the links to O*NET occupations are AI Changing Work's own judgment and are not a MIC correspondence.
(AI Changing Work link release: jp-direct v1)
本页数据的来源与许可，以及 AI Changing Work 的修改与翻译说明：致谢与来源