Microsystems Engineers
Architecture and Engineering Occupations- رمز O*NET-SOC
- 17-2199.06
Research, design, develop, or test microelectromechanical systems (MEMS) devices.
تُعرض أسماء المهن وأوصاف المهام بالإنجليزية كما نُشرت. أما التسميات، ومنها أنواع المهام، فمترجمة.
التعرّض للذكاء الاصطناعي
- مصدر البيانات: BLSتاريخ النشر: 2026-08
مرتفع جدًا· نسبي
منخفضأربع فئات نسبيةمرتفع جدًاقيمة على مستوى المجموعة المهنية
المقياس والأساس والمصدر
أربع فئات نسبية (منخفض / متوسط / مرتفع / مرتفع جدًا)
831 مهنة تفصيلية في جدول توقعات التوظيف لدى BLS. وتُسند القيمة على مستوى رمز مصفوفة التوظيف الوطنية (NEM)، فالمهن التي تشترك في الرمز نفسه تأخذ النطاق نفسه
- مصدر البيانات: Anthropicتاريخ النشر: 2026-03
0.066
0.000نطاق القيم المعروضة هنا0.745قيمة على مستوى المجموعة المهنية
المقياس والأساس والمصدر
مؤشر التعرّض المرصود، 0–1 كما نُشر
مربوط بمهام O*NET
منشورة لكل مهنة في SOC 2018؛ وكل مهنة في O*NET تحمل رمز SOC 2018 نفسه تأخذ هذه القيمة
- مصدر البيانات: ILOتاريخ النشر: 2025
0.30
0.09نطاق القيم المعروضة هنا0.70قيمة على مستوى المجموعة المهنية
المقياس والأساس والمصدر
مؤشر التعرّض للذكاء الاصطناعي التوليدي، 0–1 كما نُشر
قيمة منشورة على مستوى مجموعة الوحدة في ISCO-08. رُبطت بهذه المهنة بتطبيق جداول التناظر الرسمية لمكتب إحصاءات العمل الأمريكي (BLS) (من ISCO-08 إلى SOC 2010، ومن SOC 2010 إلى SOC 2018) كما نُشرت، والتناظر كلي أو جزئي
ما نوع القيمة التي ينشرها هذا المصدر
فئة BLS رتبة نسبية لا مستوى مطلق، وليست قياسًا مباشرًا: فهي تجمع الرتب المئينية للمهنة في عدة دراسات منشورة في أربع فئات. وهي ليست توقّعًا للتوظيف أو الأجور، ولا احتمالًا للتبني، ولا تفرّق بين الأتمتة والتعزيز.
التعرض للذكاء الاصطناعي (معيار OpenAI)
31 مهمة مقيَّمة · 23 مهمة بقيمة β ≥ 0.5 (74.2%)
β = التعرّض المباشر (E1) + 0.5 × التعرّض عند توفر الأدوات (E2)، وفق تعريف المستودع المصدري.
- وحدة المصدر: مهام O*NET 27.2 ← رمز المهنة في O*NET 31.0
- جميع المهام المقيَّمة موجودة في قائمة مهام O*NET 31.0.
- المصدر
- OpenAI "GPTs are GPTs" exposure rubric
- الإصدار
- gh-main-0471612
- الترخيص
- MIT License, Copyright (c) 2024 OpenAI
المهام
أوصاف المهام من O*NET® 31.0 Database، والمهام الأساسية أولًا.
| المهمة | النوع | β (OpenAI) |
|---|---|---|
| Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology. | أساسية | 0.5 |
| Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes. | أساسية | 1 |
| Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements. | أساسية | 1 |
| Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements. | أساسية | 0.5 |
| Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software. | أساسية | 0.5 |
| Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting. | أساسية | 0.5 |
| Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints. | أساسية | 0.5 |
| Conduct analyses addressing issues such as failure, reliability, or yield improvement. | أساسية | 0.5 |
| Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications. | تكميلية | 0.5 |
| Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays. | تكميلية | 0 |
| Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications. | تكميلية | 0 |
| Develop customer documentation, such as performance specifications, training manuals, or operating instructions. | تكميلية | 1 |
| Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems. | تكميلية | 0.5 |
| Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers. | تكميلية | 0 |
| Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications. | تكميلية | 0.5 |
| Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints. | تكميلية | 0.5 |
| Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing. | تكميلية | 0 |
| Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability. | تكميلية | 0.5 |
| Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining. | تكميلية | 0 |
| Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests. | تكميلية | 0 |
| Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement. | تكميلية | 0.5 |
| Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes. | تكميلية | 0.5 |
| Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology. | تكميلية | 0.5 |
| Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing. | تكميلية | 0.5 |
| Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software. | تكميلية | 0 |
| Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology. | — | 0.5 |
| Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining. | — | 0 |
| Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices. | — | 1 |
| Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines. | — | 1 |
| Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications. | — | 1 |
| Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy. | — | 1 |
معلومات مهنية
المصادر والإسناد
This page includes information from the O*NET® 31.0 Database (https://www.onetcenter.org/database.html) by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license (https://creativecommons.org/licenses/by/4.0/). O*NET® is a trademark of USDOL/ETA. AI Changing Work has modified all or some of this information: the O*NET-SOC code, title and task statements are reproduced in English without change; task-type labels are shown in the page's language and tasks are listed core first; any Korean occupation title shown on the Korean-language page is AI Changing Work's translation; any KSCO-8 unit groups linked to this occupation were paired with it by AI Changing Work's judgment, and the relation labels and statuses are AI Changing Work's additions. USDOL/ETA has not approved, endorsed, or tested these modifications.
Any AI exposure figures on this page are published by third parties, not by AI Changing Work, and none is part of the O*NET information. OpenAI publishes task-level scores (MIT License) for O*NET 27.2 task statements; each is shown next to the O*NET 31.0 task statement with the same task ID, whose wording can differ from the 27.2 statement that was scored. OpenAI also publishes occupation-level scores for O*NET-SOC codes in the same release, and any such score is shown on the O*NET occupation with the same code. Anthropic publishes an observed exposure index in the Anthropic Economic Index (CC-BY), and the U.S. Bureau of Labor Statistics publishes relative AI exposure categories (public domain); both are published per SOC code, and each value is shown on every O*NET occupation with that code. The International Labour Organization publishes a generative AI exposure index in ILO Working Paper 140 (CC BY 4.0) for ISCO-08 unit groups; AI Changing Work links those groups to O*NET occupations by applying the U.S. Bureau of Labor Statistics ISCO-08 to 2010 SOC and 2010 SOC to 2018 SOC crosswalks as published, without case-by-case selection, and these crosswalks match many groups only in part. Where several unit groups are linked, each group's published value is listed, and any summary shows only the lowest and highest of those values with the number of groups; no exposure figure is averaged or recalculated. Any employment figures are published by the U.S. Bureau of Labor Statistics for the SOC group containing this occupation. Each source is credited where its figures are shown.
O*NET OnLine: 17-2199.06 Microsystems Engineers
KSCO 코드·명칭: 한국표준직업분류(제8차 개정) — 통계청 고시 제2024-328호 (2024-07-01 고시, 2025-01-01 시행). 저작권법 제7조 제2호의 고시 항목이다. 명칭 표기(가운뎃점·띄어쓰기)는 해설서 2차 정오 반영판의 표기를 따랐으며, 고시 항목표와는 18개 명칭에서 가운뎃점 글리프나 띄어쓰기만 다르다. 통계청은 2025년 10월 국가데이터처로 개편되었다. 이 페이지의 KSCO 연결은 통계청·국가데이터처의 공식 연계표가 아니다.