마이크로시스템 엔지니어
건축·공학직Microsystems Engineers
- O*NET-SOC 코드
- 17-2199.06
Research, design, develop, or test microelectromechanical systems (MEMS) devices.
한국어 직업명은 AI Changing Work의 번역입니다. 과업 문장과 원천 값은 공표된 영문 그대로 표시합니다.
AI 노출도
- 데이터 출처: BLS발행 시점: 2026-08
매우 높음· 상대
낮음4단계 상대 범주매우 높음직업군 단위 값
척도 · 모수 · 출처
4단계 상대 범주 (낮음 / 보통 / 높음 / 매우 높음)
BLS 고용전망 표의 세부직업 831개 기준. 값은 NEM(전국고용매트릭스) 코드 단위로 부여되므로, 같은 NEM 코드를 쓰는 직업은 같은 밴드를 받습니다
- 데이터 출처: Anthropic발행 시점: 2026-03
0.066
0.000여기 실린 값의 범위0.745직업군 단위 값
척도 · 모수 · 출처
관측 노출 지수, 발행된 그대로 0–1
O*NET 과업 매핑 기준
SOC 2018 직업 단위로 발행된 값이며, 같은 SOC 2018 코드를 가진 O*NET 직업은 모두 이 값을 받습니다
- 데이터 출처: ILO발행 시점: 2025
0.30
0.09여기 실린 값의 범위0.70직업군 단위 값
척도 · 모수 · 출처
생성형 AI 노출 지수, 발행된 그대로 0–1
ISCO-08 직업군 단위로 발행된 값입니다. 미국 노동통계국(BLS)의 공식 교차표(ISCO-08→2010 SOC, 2010 SOC→2018 SOC)를 그대로 적용해 이 직업에 연결했으며, 연결은 전부 또는 일부 대응입니다
이 원천이 어떤 종류의 값인가
BLS 범주는 절대 수준이 아니라 상대 순위이며, 1차 측정도 아닙니다. 여러 선행 연구가 매긴 직업별 백분위 순위를 4단계로 묶은 값입니다. 고용·임금 예측도, 도입 확률도 아니며 자동화와 증강을 구분하지 않습니다.
AI 노출도 (OpenAI 루브릭)
평가 과업 31개 · β ≥ 0.5 인 과업 23개 (74.2%)
β = 직접 노출(E1) + 0.5 × 도구 활용 시 노출(E2). 원본 저장소의 정의를 따릅니다.
- 원천 단위: O*NET 27.2 과업 → O*NET 31.0 직업 코드
- 채점된 과업이 모두 O*NET 31.0 과업 목록에 있습니다.
- 출처
- OpenAI "GPTs are GPTs" exposure rubric
- 판
- gh-main-0471612
- 라이선스
- MIT License, Copyright (c) 2024 OpenAI
과업
O*NET® 31.0 Database의 과업 문장입니다. 핵심(Core) 과업을 먼저 보입니다.
| 과업 | 유형 | β (OpenAI) |
|---|---|---|
| Plan or schedule engineering research or development projects involving microelectromechanical systems (MEMS) technology. | 핵심 | 0.5 |
| Communicate operating characteristics or performance experience to other engineers or designers for training or new product development purposes. | 핵심 | 1 |
| Create or maintain formal engineering documents, such as schematics, bills of materials, components or materials specifications, or packaging requirements. | 핵심 | 1 |
| Propose product designs involving microelectromechanical systems (MEMS) technology, considering market data or customer requirements. | 핵심 | 0.5 |
| Investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (MEMS) device designs, using simulation or modeling software. | 핵심 | 0.5 |
| Develop formal documentation for microelectromechanical systems (MEMS) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting. | 핵심 | 0.5 |
| Create schematics and physical layouts of integrated microelectromechanical systems (MEMS) components or packaged assemblies consistent with process, functional, or package constraints. | 핵심 | 0.5 |
| Conduct analyses addressing issues such as failure, reliability, or yield improvement. | 핵심 | 0.5 |
| Manage new product introduction projects to ensure effective deployment of microelectromechanical systems (MEMS) devices or applications. | 보조 | 0.5 |
| Develop or implement microelectromechanical systems (MEMS) processing tools, fixtures, gages, dies, molds, or trays. | 보조 | 0 |
| Identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (MEMS) applications. | 보조 | 0 |
| Develop customer documentation, such as performance specifications, training manuals, or operating instructions. | 보조 | 1 |
| Develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (MEMS) devices, products, or systems. | 보조 | 0.5 |
| Demonstrate miniaturized systems that contain components, such as microsensors, microactuators, or integrated electronic circuits, fabricated on silicon or silicon carbide wafers. | 보조 | 0 |
| Conduct acceptance tests, vendor-qualification protocols, surveys, audits, corrective-action reviews, or performance monitoring of incoming materials or components to ensure conformance to specifications. | 보조 | 0.5 |
| Refine final microelectromechanical systems (MEMS) design to optimize design for target dimensions, physical tolerances, or processing constraints. | 보조 | 0.5 |
| Oversee operation of microelectromechanical systems (MEMS) fabrication or assembly equipment, such as handling, singulation, assembly, wire-bonding, soldering, or package sealing. | 보조 | 0 |
| Evaluate materials, fabrication methods, joining methods, surface treatments, or packaging to ensure acceptable processing, performance, cost, sustainability, or availability. | 보조 | 0.5 |
| Devise microelectromechanical systems (MEMS) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining. | 보조 | 0 |
| Develop or validate specialized materials characterization procedures, such as thermal withstand, fatigue, notch sensitivity, abrasion, or hardness tests. | 보조 | 0 |
| Develop or validate product-specific test protocols, acceptance thresholds, or inspection tools for quality control testing or performance measurement. | 보조 | 0.5 |
| Conduct or oversee the conduct of prototype development or microfabrication activities to ensure compliance to specifications and promote effective production processes. | 보조 | 0.5 |
| Conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (MEMS) technology. | 보조 | 0.5 |
| Validate fabrication processes for microelectromechanical systems (MEMS), using statistical process control implementation, virtual process simulations, data mining, or life testing. | 보조 | 0.5 |
| Conduct harsh environmental testing, accelerated aging, device characterization, or field trials to validate devices, using inspection tools, testing protocols, peripheral instrumentation, or modeling and simulation software. | 보조 | 0 |
| Consider environmental issues when proposing product designs involving microelectromechanical systems (MEMS) technology. | — | 0.5 |
| Design or develop energy products using nanomaterials or nanoprocesses, such as micro-nano machining. | — | 0 |
| Design or develop industrial air quality microsystems, such as carbon dioxide fixing devices. | — | 1 |
| Design or develop sensors to reduce the energy or resource requirements to operate appliances, such as washing machines or dishwashing machines. | — | 1 |
| Design sensors or switches that require little or no power to operate for environmental monitoring or industrial metering applications. | — | 1 |
| Research or develop emerging microelectromechanical (MEMS) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy. | — | 1 |
직업 정보
출처와 귀속
This page includes information from the O*NET® 31.0 Database (https://www.onetcenter.org/database.html) by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license (https://creativecommons.org/licenses/by/4.0/). O*NET® is a trademark of USDOL/ETA. AI Changing Work has modified all or some of this information: the O*NET-SOC code, title and task statements are reproduced in English without change; task-type labels are shown in the page's language and tasks are listed core first; any Korean occupation title shown on the Korean-language page is AI Changing Work's translation; any KSCO-8 unit groups linked to this occupation were paired with it by AI Changing Work's judgment, and the relation labels and statuses are AI Changing Work's additions. USDOL/ETA has not approved, endorsed, or tested these modifications.
Any AI exposure figures on this page are published by third parties, not by AI Changing Work, and none is part of the O*NET information. OpenAI publishes task-level scores (MIT License) for O*NET 27.2 task statements; each is shown next to the O*NET 31.0 task statement with the same task ID, whose wording can differ from the 27.2 statement that was scored. OpenAI also publishes occupation-level scores for O*NET-SOC codes in the same release, and any such score is shown on the O*NET occupation with the same code. Anthropic publishes an observed exposure index in the Anthropic Economic Index (CC-BY), and the U.S. Bureau of Labor Statistics publishes relative AI exposure categories (public domain); both are published per SOC code, and each value is shown on every O*NET occupation with that code. The International Labour Organization publishes a generative AI exposure index in ILO Working Paper 140 (CC BY 4.0) for ISCO-08 unit groups; AI Changing Work links those groups to O*NET occupations by applying the U.S. Bureau of Labor Statistics ISCO-08 to 2010 SOC and 2010 SOC to 2018 SOC crosswalks as published, without case-by-case selection, and these crosswalks match many groups only in part. Where several unit groups are linked, each group's published value is listed, and any summary shows only the lowest and highest of those values with the number of groups; no exposure figure is averaged or recalculated. Any employment figures are published by the U.S. Bureau of Labor Statistics for the SOC group containing this occupation. Each source is credited where its figures are shown.
O*NET OnLine: 17-2199.06 Microsystems Engineers
KSCO 코드·명칭: 한국표준직업분류(제8차 개정) — 통계청 고시 제2024-328호 (2024-07-01 고시, 2025-01-01 시행). 저작권법 제7조 제2호의 고시 항목이다. 명칭 표기(가운뎃점·띄어쓰기)는 해설서 2차 정오 반영판의 표기를 따랐으며, 고시 항목표와는 18개 명칭에서 가운뎃점 글리프나 띄어쓰기만 다르다. 통계청은 2025년 10월 국가데이터처로 개편되었다. 이 페이지의 KSCO 연결은 통계청·국가데이터처의 공식 연계표가 아니다.